Parallel single substrate processing fluid jet module

ABSTRACT

A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of fluid jet elements to inject a fluid at the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.

RELATED APPLICATIONS

This application claims the benefit of and priority from U.S.Provisional Patent Application Ser. No. 61/493,183 Entitled “SUBSTRATEPROCESSING SYSTEM” and filed on Jun. 3, 2011 and U.S. Provisional PatentApplication Ser. No. 61/589,697 Entitled “PARALLEL SINGLE SUBSTRATEPROCESSING SYSTEM” and filed on Jan. 23, 2012 and U.S. ProvisionalPatent Application Ser. No. 61/590,199 Entitled “MARANGONI DRYERAPPARATUS” and filed on JANUARY 24, 2012 all of which are herebyincorporated by reference herein in their entirety. This application isrelated to U.S. patent application having Attorney Docket Number1146P014618-US(PAR), filed Jun. 4, 2012 and entitled “PARALLEL SINGLESUBSTRATE PROCESSING SYSTEM”, U.S. patent application having AttorneyDocket Number 1146P014674-US(PAR), filed Jun. 4, 2012 and entitled“PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM”, U.S. patent applicationhaving Attorney Docket Number 1146P014664-US(PAR), filed Jun. 4, 2012and entitled “PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM HOLDER”, U.S.patent application having Attorney Docket Number 1146P014665-US(PAR),filed Jun. 4, 2012 and entitled “PARALLEL SINGLE SUBSTRATE PROCESSINGSYSTEM LOADER”, U.S. patent application having Attorney Docket Number1146P014729-US(PAR), filed Jun. 4, 2012 and entitled “PARALLEL SINGLESUBSTRATE PROCESSING SYSTEM”, U.S. patent application having AttorneyDocket Number 1146P014727-US(PAR), filed Jun. 4, 2012 and entitled“PARALLEL SINGLE SUBSTRATE PROCESSING AGITATION MODULE” and U.S. patentapplication having Attorney Docket Number 1146P014658-US(PAR), filedJun. 4, 2012 and entitled “PARALLEL SINGLE SUBSTRATE MARANGONI MODULE”.

BACKGROUND

1. Field

The exemplary embodiment generally relates to a substrate processingsystem and, more particularly, to vertical fluid parallel single waferprocessing system.

2. Brief Description of Related Developments

Fluid processing, among other processes, is used as a manufacturingtechnique for the application or removal of films and materials tovarious structures and surfaces, such as semiconductor wafers andsilicon work pieces or substrates. Fluid processing in a verticalorientation allows full immersion of the substrate being processed andmanipulation of the fluid in close proximity to the surface of thewafer. A problem arises where transport and processing of substrates ina vertical orientation requires precise positioning with little risk ofdamage to the substrate during transport or processing. A furtherproblem arises where transport and processing of substrates from ahorizontal to a vertical orientation requires a high reliability andhigh speed transport system. Accordingly, there is a desire for new andimproved methods and apparatus for transporting and processingsubstrates in a vertical orientation.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the disclosed embodimentsare explained in the following description, taken in connection with theaccompanying drawings, wherein:

FIG. 1 shows an isometric view of an exemplary parallel single substrateprocessing system;

FIG. 2 shows a top view of an exemplary parallel single substrateprocessing system;

FIG. 3 shows a top view of an exemplary parallel single substrateprocessing system;

FIG. 4 shows a side view of an exemplary parallel single substrateprocessing system;

FIG. 5 shows a partial isometric view of an exemplary parallel singlesubstrate processing system;

FIG. 6 shows a partial side view of an exemplary parallel singlesubstrate processing system;

FIG. 7 shows a top view of an exemplary parallel single substrateprocessing system;

FIG. 8 shows a partial isometric view of an exemplary parallel singlesubstrate processing system;

FIG. 9 shows a partial side view of an exemplary parallel singlesubstrate processing system;

FIG. 10 shows a partial end view of an exemplary parallel singlesubstrate processing system;

FIG. 11 shows a partial isometric view of an exemplary parallel singlesubstrate processing system;

FIG. 12A shows a partial front view of an exemplary parallel singlesubstrate processing system;

FIG. 12B shows a partial rear view of an exemplary parallel singlesubstrate processing system;

FIG. 12C shows a partial side view of an exemplary parallel singlesubstrate processing system;

FIG. 12D shows a partial side view of an exemplary parallel singlesubstrate processing system;

FIG. 13 shows a wafer holder;

FIG. 14 shows a wafer holderfinger

FIG. 15A shows a wafer holder;

FIG. 15B shows a wafer holder;

FIG. 15C shows a wafer holder;

FIG. 15D shows a wafer holder;

FIG. 16A shows a portion of a wafer holder;

FIG. 16B shows a portion of a wafer holder;

FIG. 17 shows an array of wafer holders;

FIG. 18A shows a portion of a wafer holder;

FIG. 18B shows a portion of a wafer holder;

FIG. 19 shows an isometric view of a loader module;

FIG. 20 shows an end view of a loader module;

FIG. 21 shows an end view of a loader module;

FIG. 22A shows an isometric view of a loader module and a holder array;

FIG. 22B shows an isometric view of a loader module and a holder array;

FIG. 23A shows a front view of a loader module and a holder array on atransporter;

FIG. 23B shows a side view of a loader module and a holder array and atransporter;

FIG. 23C shows a section view of a holder crossmember;

FIG. 24A shows a partial front view of a loader module and a holderarray;

FIG. 24B shows a partial front view of a loader module and a holderarray;

FIG. 24C shows a partial front view of a loader module and a holderarray;

FIG. 24D shows a partial front view of a loader module and a holderarray;

FIG. 24E shows a partial front view of a loader module and a holderarray;

FIG. 24F shows a partial front view of a loader module and a holderarray;

FIG. 24G shows a partial front view of a loader module and a holderarray;

FIG. 24H shows a partial front view of a loader module and a holderarray;

FIG. 24I shows a partial front view of a loader module and a holderarray;

FIG. 24J shows a partial front view of a loader module and a holderarray;

FIG. 24K shows a partial front view of a loader module and a holderarray;

FIG. 24L shows a partial front view of a loader module and a holderarray;

FIG. 24M shows a partial front view of a loader module and a holderarray;

FIG. 25A shows a table of loader motions;

FIG. 25B shows a table of loader motions;

FIG. 25C shows a table of loader motions;

FIG. 25D shows a table of loader motions;

FIG. 25E shows a table of loader motions;

FIG. 26 shows a partial isometric view of a loader module;

FIG. 27 shows a partial isometric view of a loader module;

FIG. 28A shows an isometric view of a holder array;

FIG. 28B shows a side view of a holder array;

FIG. 28C shows a partial isometric view of a holder array;

FIG. 28D shows a partial sideview of a holder array;

FIG. 29A shows a transporter and array motion and state table;

FIG. 29B shows a transporter and array motion and state table;

FIG. 29C shows a transporter and array motion and state table;

FIG. 29D shows a transporter and array motion and state table;

FIG. 29E shows a transporter and array motion and state table;

FIG. 29F shows a transporter and array motion and state table;

FIG. 29G shows a transporter and array motion and state table;

FIG. 29H shows a transporter and array motion and state table;

FIG. 30A shows a partial front view of a loader module and a holderarray;

FIG. 30B shows a partial front view of a loader module and a holderarray;

FIG. 31 shows an isometric view of a shear plate agitation module;

FIG. 32A shows a side view of a shear plate agitation module;

FIG. 32B shows a side view of a shear plate agitation module;

FIG. 32C shows a side view of a shear plate agitation module;

FIG. 33A shows an isometric view of a shear plate agitation module;

FIG. 33B shows an isometric view of a shear plate agitation module;

FIG. 33C shows an isometric view of a shear plate agitation module;

FIG. 34 shows an end view of a shear plate agitation module;

FIG. 35 shows an isometric view of a shear plate agitation module;

FIG. 36A shows an isometric view of a shear plate agitation module;

FIG. 36B shows an isometric view of a shear plate agitation module;

FIG. 37A shows an isometric view of a shear plate agitation module;

FIG. 37B shows an isometric view of a shear plate agitation module;

FIG. 38A shows an isometric view of a shear plate agitation module;

FIG. 38B shows an isometric view of a shear plate agitation module;

FIG. 39A shows an isometric view of a guide roller;

FIG. 39B shows a section view of a guide roller;

FIG. 40A shows a front view of a shear plate agitation module;

FIG. 40B shows a front view of a shear plate agitation module;

FIG. 41 shows an isometric view of a shear plate agitation module;

FIG. 42A shows an isometric view of a shear plate agitation member;

FIG. 42B shows an isometric view of a shear plate agitation member;

FIG. 43A shows an isometric view of a shear plate agitation module;

FIG. 43B shows an isometric view of a shear plate agitation module;

FIG. 43C shows an isometric view of a shear plate agitation module;

FIG. 44 is a schematic diagram of a Marangoni dryer module;

FIG. 45 is a process flow diagram;

FIG. 46A is an isometric views of a portion of a weir;

FIG. 46B is a top view of a portion of a weir;

FIG. 47A is an isometric view of a parallel single wafer processingmodule;

FIG. 47B is a side view of a parallel single wafer processing module;

FIG. 47C is a side view of a parallel single wafer processing module;

FIG. 48A is an isometric view of a parallel single wafer processingmodule;

FIG. 48B is an isometric view of a parallel single wafer processingmodule;

FIG. 48C is a top view of a parallel single wafer processing module;

FIG. 49A is a side view of a parallel single wafer processing module;

FIG. 49B is a side view of a parallel single wafer processing module;

FIG. 50A is a section view of a linear IPA nozzle exhaust andweirassembly;

FIG. 50B is a section view of a linear IPA nozzle exhaust andweirassembly;

FIG. 50C is a section view of a linear IPA nozzle exhaust andweirassembly;

FIG. 51A is a isometric view of a linear IPA nozzle Exhaust andweirmanifold assembly;

FIG. 51B is a side view of a linear IPA nozzle Exhaust andweir manifoldassembly;

FIG. 51C is a top view of a weir drain plate;

FIG. 51D is a section view of a weir drain plate;

FIG. 52 is a section view of a linear IPA nozzle exhaust andweirassembly;

FIG. 53A is an isometric view of a holder in a linear IPA nozzle exhaustand weir assembly;

FIG. 53B is a top view of a holder in a linear IPA nozzle exhaust andweir assembly;

FIG. 54 is an isometric view of a Marangoni dry module;

FIG. 55 is a section view of a Marangoni dry module;

FIG. 56A is an isometric view of and IPA injector manifold;

FIG. 56B is a section view of and IPA injector manifold;

FIG. 56C is a section view of and IPA injector manifold;

FIG. 57A is an isometric section view of a bottom plate;

FIG. 57B is an isometric view of a plate;

FIG. 58 is an isometric view of and IPA injector nozzle manifold and N2purge manifold;

FIG. 59 is a section view of an Air Knife;

FIG. 60A is a section view of a holder and Marangoni dry module;

FIG. 60B is a section view of a holder and Marangoni dry module;

FIG. 60C is a section view of a holder and Marangoni dry module;

FIG. 61A is a isometric view of a linear nozzle;

FIG. 61B is a isometric view of a linear nozzle;

FIG. 61C is a isometric view of a linear nozzle;

FIG. 62A is a side view of a wafer holder and a process module in afirst position;

FIG. 62B is a side view of a wafer holder and a process module in asecond position;

FIG. 63A is a section view of a wafer holder and a process module;

FIG. 63B is a section view of a wafer holder and a process module;

FIG. 63C is a section view of a wafer holder and a process module;

FIG. 64 is a side view of an array of wafer holders and a processmodule;

FIG. 65A is a section view of an array of wafer holders and a processmodule;

FIG. 65B is a section view of an array of wafer holders and a processmodule;

FIG. 65C is a section view of an array of wafer holders and a processmodule;

FIG. 65D is a section view of a nozzle manifold;

FIG. 65E is a section view of an array of wafer holders and a processmodule;

FIG. 66 shows a side view of a fluid jet parallel single wafer processmodule;

FIG. 67 shows an isometric partial section view of a fluid jet parallelsingle wafer process module;

FIG. 68A shows an isometric partial section view of a fluid jet parallelsingle wafer process module;

FIG. 68B shows an isometric partial section view of a fluid jet parallelsingle wafer process module;

FIG. 68C shows an isometric partial section view of a fluid jet parallelsingle wafer process module;

FIG. 69 shows an isometric partial section view of a fluid jet parallelsingle wafer process module;

FIG. 70 shows a side view of a fluid jet parallel single wafer processmodule;

FIG. 71 shows an isometric partial section view of a fluid jet nozzlearray;

FIG. 72 shows an isometric view of a fluid jet nozzle array;

FIG. 73A shows an isometric partial section view of a fluid jet parallelsingle wafer process module;

FIG. 73B shows an isometric partial section view of a fluid jet parallelsingle wafer process module; and

FIG. 73C shows an isometric partial section view of a fluid jet parallelsingle wafer process module.

DETAILED DESCRIPTION

FIG. 1 illustrates a parallel single substrate processing system inaccordance with an aspect of the disclosed embodiment. Although theaspects of the disclosed embodiment will be described with reference tothe drawings, it should be understood that the aspects of the disclosedembodiment can be embodied in many forms. In addition, any suitablesize, shape or type of elements or materials could be used.

Referring now to FIG. 1, there is shown an isometric view of anexemplary parallel single substrate processing system 200. Referringalso to FIG. 2, there is shown a top view of an exemplary parallelsingle substrate processing system 200. Referring also to FIG. 3, thereis shown a top view of an exemplary parallel single substrate processingsystem 200. Referring also to FIG. 4, there is shown a side view of anexemplary parallel single substrate processing system 200. Substrateprocessing machine 200 may suitable for a manufacturing process usingthe present disclosed embodiment. The disclosed embodiment may beimplemented in an electroplating, cleaning or etching system and may beused in combination with an electro deposition machine such as theStratus from NEXX Systems in Billerica Mass. In alternate aspects of thedisclosed embodiment, system 200 and modules 210 may be used incombination with any suitable substrate processing system. System 200and modules 210 may incorporate features as disclosed in theInternational Application WO 2005/042804 A2 published under the PatentCooperation Treaty and having publication date May 12, 2005 and asdisclosed in U.S. Publication No. 2005/0167275 published Aug. 14, 2005and entitled method and apparatus for fluid processing a work piece,both of which are hereby incorporated by reference herein in theirentirety. System 200 is shown as an exemplary system. In alternateaspects of the disclosed embodiment, more or less modules may beprovided having different configurations and locations. Machine 200 mayhave features as disclosed in U.S. Provisional Patent Application No.61/493,183 filed on Jun. 3, 2011 and entitled Substrate ProcessingSystem which is hereby incorporated by reference herein in its entirety.Machine 200 may contain load ports 206 by which substrates previouslyprocessed, such as being patterned with photoresist or otherwiseprocessed are inserted and withdrawn from the system. Loading station204 may have a robotic arm 276 which transfers substrates 278 indirectlyor directly into wafer loader module 274 where wafer loader module 274may load wafer(s) to holders 270, 272. Loader module 274 may be a batchexchange loader having a shuttle with an input 274′, loading/unloading274″ and output 274″′ positions as will be described in greater detailbelow. In alternate aspects of the disclosed embodiment, loader module274 may have features allowing for rotating holder 270 and gripping andungripping one or more wafers either in parallel or selectively ofholder 270. In alternate aspects of the disclosed embodiment, roboticarm 276 may transport a single wafer, a batch of wafers or a combinationthereof. In alternate aspects of the disclosed embodiment, more than oneloader module 274 may be provided to load holders 270, 272 in parallelor to load wafers onto different types of holders where holders 270, 272may have different features or be used for different types of processes.In alternate aspects of the disclosed embodiment, loading station 204may have a robotic arm 276 which transfers substrates 278 directly intosubstrate-holders 270, 272 which are then transferred by transport 280to modules 210 and processed either in parallel, in succession or incombination parallel and succession. In one aspect of the disclosedembodiment, transporter 280 or a separate holder support may havefeatures allowing for the direct handoff of wafers from robot 276 toholder 270 where transporter 280, for example, would have featuresallowing for rotating holder 270 and gripping and un-gripping one ormore wafers either in parallel or selectively of holder 270. Althoughone transporter 280 is shown, more may be provided operating in parallelor otherwise. By way of example, substrate holders 270, 272 may featurea single wafer or a batch wafer flexure wafer holding mechanism asfurther described in the disclosed embodiment to follow. In alternateaspects of the disclosed embodiment, holders 270, 272 may be acombination of flexure wafer holding mechanism as further described andwafer holders as disclosed in the aforementioned publications withrespect to the Stratus system from NEXX Systems in Billerica Mass. Inalternate aspects of the disclosed embodiment, any suitable combinationof holder(s) may be utilized within system 200. Process modules 210 mayhave features as further described in the disclosed embodiment tofollow, for example, where modules 210 may be suitable forelectroplating wafers, anodizing wafers, cleaning wafers, such as liquidstripping of photoresist, seed layer etching, general wafer cleaning orotherwise. In the disclosed embodiment, wafer-holders and the associatedprocess apparatus utilize a flexure based wafer-holding mechanism toprocess wafers in a vertical orientation and thereby utilize variousaspects of a vertical orientation for fluid processing to allow for fullimmersion of the wafer into a fluid bath and to facilitate agitating thefluid near the surface of the wafer, for example by SHEAR PLATEagitation close to the wafer surface either alone or in combination withvarious nozzle jets close to the wafer surface, either for sprayingliquid or gas at the wafer surface or for drying via the Marangonieffect as wafers are vertically withdrawn from an immersed conditioninto an ambient atmosphere non-immersed condition or for drying viablowing a gas, such as clean dry nitrogen, through a linear nozzle orplurality of nozzles, toward the wafer surface. The disclosed embodimentencompass both single wafer vertical processing and batch wafer verticalprocessing or a combination of single and batch wafer verticalprocessing. For example, single wafer holders may be processed in asingle wafer process and then subsequently ganged together for one ormore batch process. Alternately, system 200 may have all single or allbatch wafer processing. In alternate aspects of the disclosedembodiment, the flexure based wafer holders may be used in processing inany suitable orientation, vertical, horizontal or otherwise. In eithersingle or batch wet processing tools, as will be described in greaterdetail, a provision is further disclosed for precision location of wafersurfaces relative to the fluid process elements where the fluid processelements may be one or more agitation paddle(s) or member(s) (e.g. SHEARPLATE agitation members), linear fluid drains, linear nozzle air or N2knives, Marangoni-dry linear nozzles and nozzle arrays for wafer holderarrays, scanning nozzle arrays or otherwise. Controller(s) 220 may beprovided within each station or module to sequence the process and/ortransport within the station or module. A system controller(s) 222 maybe provided within the system 200 to sequence substrates between thestations or process modules and to coordinate system actions, such as,host communication, lot loading and unloading or otherwise those actionsthat are required to control the system 200. In alternate aspects of thedisclosed embodiment, process modules 210 may include a combination ofcleaning and electro deposition modules. In alternate aspects of thedisclosed embodiment, more or less modules in more or less suitablecombinations may be provided in any suitable combination. As such, allsuch variations, alternatives and modifications of system 200configurations are embraced.

Referring now to FIG. 8, there is shown a batch wafer process system orparallel single substrate processing system 240. Referring also to FIG.9, there is shown a side view of batch wafer process system or parallelsingle substrate processing system 240. Referring also to FIG. 10, thereis shown an end view of batch wafer process system or parallel singlesubstrate processing system 240. In the disclosed embodiment, there maybe three levels in the tool: (1) transport 256, (2) process 258, and (3)Marangoni-dryer 260. In the embodiment shown, a transporter (not shown)may handle a multiplicity of wafer holders 244, 246 between processmodules 262, 264, 266, 268, 270, for example along axes 272, 274. In theembodiment shown, six wafer holders are shown in each array 244, 246. Inalternate aspects of the disclosed embodiment, any suitable number ofwafer holder(s) may be used in each array, for example, 1, 13 or anysuitable number. The virtual array 244 of wafer holders may be movedthrough the tool from process to process by the transporter. As will bedescribed below in greater detail with respect to the embodiment shownin FIG. 7, a shuttle may be provided having a load/unload position 250,an input position and/or array 248 and an output position and/or array252. By way of example, wafers to be processed may be loaded, forexample, from a wafer carrier or FOUP into array 248, shuttled to loadposition 250 and transferred to holder 246 to be processed. By way offurther example, wafers that have been processed may be transferred fromholder 246 to output array 252 at unload position 250 and shuttled tooutput position 252 to be unloaded for post processing or to betransferred to a wafer carrier or FOUP or otherwise. In alternateaspects of the disclosed embodiment, a single shuttle array may be usedto accept processed wafers from and supply unprocessed wafers to holder246 as will be described. Although in the embodiment shown holder array246 is shown horizontal, in alternate aspects of the disclosedembodiment, array 246 may be in a vertical orientation. In alternateaspects of the disclosed embodiment, array 246 may be shuttled fromposition 250 to position 252 or from position 248 to position 250 fortransfer of wafers directly to or from a robot without the use ofintermediate arrays. Further, in alternate aspects of the disclosedembodiment, separate load and unload stations may be provided, forexample, in line with input and output stations 248, 252 or in line withthe process modules. Further, in alternate aspects of the disclosedembodiment, for loading and unloading the wafer, holders may be insertedinto a Load-Station which rotates the whole array 90 degrees to allowfor horizontal wafer transfer. Here, load station 250 may be provided todrop the wafer holder 246 blades off into a cradle that can rotate 90degrees to present the wafers horizontally and provide a simple camdriven actuation to pry open the flexures to allow for wafer transfer.In the disclosed embodiment, the transporter may carry an array of waferholders without building the array into a “cassette” of any sort, andinstead simply treating the wafer holder as a blade, which is formedinto an array each time a multiplicity of them are picked up by thetransporter. With respect to process modules 262-268, the height of thefluid line in the subsequent steps, for example, solvent rinse and DIWrinse, may be higher than the top of the wafer holder during the finalrinse and dry steps. As will be described and shown in greater detailbelow, angled surfaces on the wafer holder may be provided to minimizefluid capture that would otherwise occur on horizontal surfaces, andallowing complete rinsing of the wafer holder. In the disclosedembodiment, system 240 may have a transporter with a wafer holdergripper that may pick-up and release an array of 6 wafer holders attime. In alternate aspects of the disclosed embodiment, the system maybe configurable to handle array(s) of holders with more or lesssubstrates or with different numbers of holders in different processmodules. Further and as will be described in greater detail,Marangoni-dryer module 290 and shear plate agitation fluid modules626-268 may be provided that accept multiple wafer holders. In thedisclosed embodiment, six single sided wafer holders may be spaced atabout 1″ to 1.5″ pitch or otherwise to make up array 244. The individualwafer holders allow access to the rear surface of wafers, for example,for a Marangoni-dry process and certainty of avoiding DFR particlere-deposition on the wafer backside. The system 240 potentialapplications may be embodied with either batch loading in a horizontalor vertical plane, single wafer loading in a horizontal or verticalplane or a combination of single and/or batch loading with any suitablecombination of process and/or holder types. In the disclosed embodiment,an exemplary system layout is shown for batch or parallel singlesubstrate processing, for example, for photoresist strip. Here, anexample of an embodiment for the vertical wafer fluid processing tool isfor batch removal of dry film photoresist. By way of example, modules262-268, 290 may be one or more of a Batch SHEAR PLATE agitationpre-soak tank, Batch SHEAR PLATE agitation resist dissolution tank,Batch SHEAR PLATE agitation IPA clean tank and/or Batch Marangoni IPAdryer tank 290 or any other suitable combination of one or more processmodules. As shown, there are 4 or 5 process stations where the final DIwater rinse may be combined into the process station of the Marangonidryer 290. In alternate aspects of the disclosed embodiment, more orless modules may be added to eliminate any bottlenecks in the processingwhere different steps may also have the same or different batch sizesused alone or in combination with other batch sizes. Accordingly, thedisclosed embodiment is intended to embrace all such combinations.

Referring now to FIG. 7, there is shown a top view of an exemplaryparallel single wafer processing system 300. Referring also to FIG. 5,there is shown a partial isometric view of batch parallel single waferprocess system 300. Referring also to FIG. 6, there is shown a partialside view of parallel single wafer process system 300. In theembodiment, system 300 has wafer transport portion 304, batch load andunload portion 306, process portion 308 and storage or powerdistribution portion 302. Here, a substrate transport system transportssubstrates between process modules 340, 342, 346, 344 and carriers 312.Here, and as will be described in greater detail, system 300 has anarray of wafer holders, the array of wafer holders having individualholders that are moveable and independently positionable with respect tothe other holders in the array of holders. Transporter 326 is adapted totransport the array of holders as a unit from process modules 340, 342to a loader 324 where loader 324 is adapted to unload substrates fromthe array of holders and load new wafers to the array of holders in afast swap operation. Substrate transport robot 314 transports thesubstrates between the loader 324 and the carriers 312. Wafers 310 maybe transported from pod door openers 312 by robot 314 to or from inputshuttle array 322 or output shuttle array 320. Robot 314 may have asingle arm and end effector or two arms and/or two end effectors, forexample, to simultaneously load input and remove output wafers. Loaderand unloader 306 has a shuttle that may selectively position inputshuttle array 322 from input position 332 to load position 330. Loaderand unloader 306 has a shuttle that may selectively position outputshuttle array 320 from output position 334 to unload position 330. Aswill be described in greater detail below, at load and/or unloadposition 330, transporter 326 may transport wafer holder array 324 toload and/or unload position 330 to load a batch of wafers to beprocessed from input shuttle array 322 to wafer holder array 324 or tounload a batch of wafers that have been processed from wafer holderarray 324 to output shuttle array 320. One or more shuttle array(s) 320,322 may be provided where shuttle array(s) 320, 322 may have the samenumber of holder positions as wafer holder array 324 or alternately mayhave more positions as will be described in greater detail below, forexample, where shuttle array 320 is capable of simultaneously holdingboth an input and output batch of wafers for fast swap with wafer holderarray 324. In alternate aspects of the disclosed embodiment, shuttle 306may not be provided with shuttle array(s), for example, where waferholder array 324 is transported by shuttle 306 to position 330, 332, 334or otherwise where shuttle may have the capability to re-orient and/oractuate members of holder 324 and facilitate direct transport of wafersbetween robot 314 and wafer holder array 324. In alternate aspects ofthe disclosed embodiment, additional and/or separate load and unloadpositions may be provided and more or less input and/or output positionsmay be provided. For example, a single position or shuttle array may beused for input and output or separate load and unload positions may beprovided. The shuttle may have a single shuttle axis or multiple axis,for example, to independently position one or more shuttle arrays. Batcharrays may be employed in the disclosed embodiment to enable fastertransfer, for example, 250 wafer per hour mechanical throughput, forexample, which may be used for front-end cleans, strip cleans orotherwise, and to provide improved tool layout and access. In theembodiment shown, side mounted Transporter robot 326 is shown, forexample with a main bearing and automation mounted low on the side oftool 300. System 300 utilizes vertical wafer transfer using Shuttle 320,322, allowing for pre-load or post-unload of Shuttle 320, 322 bywafer-robot 314 where robot 314 may have a supinating wrist so thattransfer to shuttle array 320, 322 may be accomplished in verticalorientation. Here, a 13 wafer batch of wafer holders 324 may beexchanged, for example, in 30 seconds between Transporter 326 andshuttle 320, 322, decoupling the front-end wafer robot 314 fromtransporter 326 actuation. Further and as will be described in greaterdetail, a cantilevered structure for tank automation is shown for shearplate modules 340, 342 and 344 and Marangoni module 346. System 300 isshown having a wide tool structure, encompassing a 4 FOUP front-end 304and allows for both the Vertical-Transfer-Loader 330 and the Side-Robot326. The wafer plane is shown parallel to the Y axis of movement throughthe tool. Heated covers may be provided close over the wafer section,and under the handle section of the wafer holder after wafer holderarrays are inserted into process tanks, thereby avoiding condensation ofhot stripper or other chemistry on the wafer holder cross-beam. As willbe described, batch Marangoni dry 346 may have 13 meniscus interfacesbeing balanced simultaneously. In the embodiment shown, a 13 elementwafer holder batch having a direction of travel (Y-direction) parallelto wafer surface is shown. In alternate aspects of the disclosedembodiment, any suitable number of wafers or elements or orientation oftravel may be provided. In FIG. 5 and FIG. 6, two wafer holder batchesare shown, one in the process position 324′ in the Loader 330, and onein the Transport position 324 where 326 transports the wafer holderarray between the two positions as well as in the y axis direction.Marangoni dryer module 346 is shown taller and may have an integratedlift. The load-station 330 into which the wafer holder array batch 324is deposited by transporter 326 is such that the wafer holder batch 324is held in fixed position by loader 330 where transporter 326 mayrelease wafer holder array 324 and move away to other activity. Z motionof about 20″ or otherwise may be required by transporter 326. Inalternate aspects of the disclosed embodiment, transporter 326 mayfurther have an x axis or one or more suitable rotation axis toselectively position wafer holder array 324 in any suitable orientation,for example, where more or less loading stations or process or postprocess modules may be provided in different locations or otherwise.Actuation may be provided on load-station 330 that pushes open the legsof wafer holder 324 to release the Wafers. An X-motion Shuttle may beprovided that has positions for Input-Wafers 322 and Output-Wafers 320,for example, three positions for each wafer in the wafer holder batch.In alternate aspects of the disclosed embodiment, any suitable number ofselectable locations may be provided on one or more independent shuttleson the same or different axes of motion. By way of example, for a 1.5″pitch in the wafer holder batch 324 this indicates a selectable pitch,for example, a 0.5″ pitch on the Shuttle, such that the Shuttle moves+−X by about 0.5″ as will be described. Actuation of Top-Finger andBottom-Cradle on shuttle array 322, 320 may be provided on the Shuttlesuch that these wafer contact elements may be moved radially outward,for example, by 2-3 mm from the on-center wafer edge, thereby allowingthe Shuttle to move in X direction (i.e. perpendicular to the wafersurface) without contacting the Wafers held on-center by the waferholders in wafer holder batch 324. By way of example, for a 13 positionshuttle wafer holder batch 320, 322, this amounts to 2×2×13=52actuators, most likely solenoids, that can either move in pairs toexchange a wafer with the robot 314 end effector, or all 52simultaneously to engage with the loader 330 wafer holder batch assembly324. Here, minimal motion is required of the shuttle, for example, onlyabout +−0.5″ for a 1.5″ pitch wafer holder batch. Further, on-centertransfer with the end effector avoids the risk of “dropping” the waferfrom the wafer holder into the shuttle-cradle; instead the wafer isgripped simultaneously by both the end effector and the shuttle beforeeither one lets go. Here, a “drop” of 2-3 mm may be provided. In theevent a single shuttle is provided, robot 314 would be idled when theBatch transfer is being done. In contrast, when using two Shuttles asseen in FIG. 8, robot 314 may continue load/unload with the alternateShuttle. Here, by way of example, the gain provided by the secondshuttle may be greater for a smaller batch wafer holder array size.

Referring now to FIG. 11, there is shown a partial isometric view ofexemplary parallel single substrate processing system 200. Referringalso to FIG. 12A, there is shown a partial front view of exemplaryparallel single substrate processing system 200. Referring also to FIG.12B, there is shown a partial rear view of exemplary parallel singlesubstrate processing system 200. Referring also to FIG. 12C, there isshown a partial side view of exemplary parallel single substrateprocessing system 200. Referring also to FIG. 12D, there is shown apartial side view of exemplary parallel single substrate processingsystem 200. In the disclosed embodiment, system 200 may have processingside 346 and a buffering side. Here, for example, processing side 346 isshown having process modules 210 and Marangoni dryer module 290 whilebuffering side 348 is shown having buffering stations 350, 352, 354,358, 360′. In alternate aspects of the disclosed embodiment, sides 346,348 may include all process modules or any suitable combination ofprocess modules, buffer modules or otherwise and may be configurable tohave any combination of process modules, buffer modules or otherwise.Here, transporter 280 may be configurable to move one or more arrays ofholders 359 to any suitable location on side 346 or 348 and may beconfigured with an X axis or rotation T axis or any suitable axis tomove arrays of holders 359 from side 346 to side 348 or any suitableprocess location, buffer location or otherwise. Alternately, transporter280 may interface with shuttle 280′ that shuttles array supportingstructure 281 from side 346 to side 348. Here, transporter 280 may havea holder array supporting structure that may transport an array ofholders 359 on either side 346 and/or side 348 where either side of thetransporters holder array supporting structure may pick or place anarray of holders 359 from or to array supporting structure 281 and whereshuttle 280′ shuttles array supporting structure 281 from side 346 toside 348.

In accordance with another aspect of the disclosed embodiment, system200 for processing surfaces of a plurality of substrates is provided.System 200 has a process module 210 having a process module frame andhaving a plurality of process elements to process the substrate surfaceswithout contacting the substrate surfaces. A plurality of substrateholder assemblies 586, each having a number of substrate holders, eachof which is removably coupled to the process module frame, eachsubstrate holder in the substrate holder assembly 586 configured to holda substrate. The process module frame 210 has alignment featuresaligning each of the substrate holders in the substrate holder assemblyin repeatable alignment with respect to each of the process elements inthe plurality of process elements with each of the process elements inthe plurality of process elements being located between the substrates.A loader module 274, 400 (See FIG. 22A) configured to unload a pluralityof processed substrates from each of the substrate holder assemblies andload a plurality of unprocessed substrates to each of the substrateholder assemblies. A transporter 280 is configured to transport each ofthe substrate holder assemblies 586 to and from the process module 210and the loader module 274. The system further has a second processmodule 290, wherein the transporter is configured to transport each ofthe substrate holder assemblies to and from the process module 210, thesecond process module 290 and the loader module 274. The system furtherhas a substrate transport front end 204 configured to transport theunprocessed substrates from substrate carriers to the loader module 274and further configured to transport processed substrates from the loadermodule to the substrate carriers. The surfaces of the substrates are ina substantially vertical orientation. The plurality of process elementsmay be an array of agitation members that agitate a fluid proximate thesubstrate surfaces without contacting the substrate surfaces. Thesubstrate holder assembly may be removable from the process module frameas a unit. Each substrate holder in the substrate holder assembly 586may be removable from the process module frame independent of the otherholders in the substrate holder assembly. Each substrate holder in thesubstrate holder assembly 586 may be independently moveable andpositionable relative to the other substrate holders in the substrateholder assembly. Each of the substrate holders in the substrate holderassembly 586 is in repeatable alignment with respect to each of theprocess elements in the plurality of process elements with each of theprocess elements in the plurality of process elements being locatedbetween the substrates. System 200 is shown for fluid processing one ormore substrate surfaces arrayed in a fluid. Each of the substrateholders in the substrate holder assembly 586 is in repeatable alignmentwith respect to a corresponding process element in the plurality ofprocess elements and independent of the other process elements in theplurality of process elements with each of the process elements in theplurality of process elements being located between the substrates. Thesubstrate surfaces are maintained in parallel alignment and in avertical orientation.

In accordance with another aspect of the disclosed embodiment, a system200 for fluid processing one or more substrate surfaces arrayed in afluid is provided. System 200 has a process module or section 210 with aframe having a plurality of process elements to process the substratesurfaces without contacting the substrate surfaces. Substrate holderassembly 586 has a holder frame 946 and a number of substrate holders,each of which is coupled to the holder frame 946 and is configured forholding a substrate so that each substrate holder of the holder assemblyholds a different substrate in the substrate holder assembly fortransport as a unit with the substrate holder assembly to and from theprocess section 210. The substrate holder assembly 586 and eachsubstrate holder thereof are removably coupled to the process sectionframe 210. At least one of the substrate holders of the substrate holderassembly 586 is movable relative to the holder frame and positionable inrepeatable alignment with respect to a predetermined feature of theprocess section 210 and independent of positioning of the holder framewith respect to the process section. The holder frame may be an endeffector coupled to a transporter where the transporter is configured tomove the substrate holder assembly 586 to and from the process section210, and where the transporter 280 is configured to move a differentsubstrate holder assembly with the holder frame to and from the processsection 210. Each of the number of substrate holders may be removablycoupled to the holder frame. Each of the substrate holders in thesubstrate holder assembly 586 is independently moveable and positionablerelative to the process elements. Each of the substrate holders in thesubstrate holder assembly 586 is in repeatable alignment with respect tothe predetermined feature of the process section independent of theother substrate holders in the substrate holder assembly. Each of theprocess elements in the plurality of process elements are locatedbetween the substrates. Each of the substrate holders in the substrateholder assembly 586 is in repeatable alignment with respect to acorresponding process element in the plurality of process elements andindependent of the other process elements in the plurality of processelements with each of the process elements in the plurality of processelements being located between the substrates. A different substrate isheld by each substrate holder of the substrate holder assembly fortransport therewith as a unit to and from the process module 210. Thesubstrate holder assembly and each substrate holder of the substrateholder assembly are removably coupled to the process module frame and,when coupled to the process module frame, each substrate holder isindependently moveable and positionable relative to the other substrateholders of the substrate holder assembly 586. Each of the substrateholders in the substrate holder assembly is in repeatable alignment withrespect to the predetermined feature of the process module independentof the other substrate holders in the substrate holder assembly.

In accordance with one aspect of the disclosed embodiment, system 200for fluid processing one or more substrate surfaces arrayed in a fluidis provided. System 200 has a process section or module 210 with a frameand having plurality of process elements to process or fluid process thesubstrate surfaces without contacting the substrate surfaces. As will bedescribed, the plurality of process elements may be agitation members,drying members, fluid jet members or any suitable processing elements.Substrate holder assembly 586 (FIG. 17) having a number of substrateholders is configured for transporting one or more substrates as a unitbetween process section 210 and another location. Here, the substrateholder assembly 586 has a number of substrate holders and is configuredfor batch transport of substrates as a unit. The substrate holderassembly and each of the substrate holders are configured for removablecoupling to the process section frame. Each substrate holder in thesubstrate holder assembly 586 is configured to hold a substrate or atleast one of the substrates. The process section frame 210 has alignmentfeatures disposed so that, on coupling of the substrate holder assembly586 with the process section frame, the alignment features interfacewith each substrate holder of the substrate holder assembly 586 andlocate each substrate holder in repeatable alignment, at correspondingcoupling of each substrate holder and the process section frame, withrespect to a predetermined feature of the process section 210. Thepredetermined features may be located between the substrates with thesubstrates in a vertical orientation. The predetermined features may beeach of the process elements with each of the process elements in theplurality of process elements being located between the substrates. Thealignment feature may be vertical guides aligning each of the substrateholders in the substrate holder assembly in repeatable alignment withrespect to a corresponding process element in the plurality of processelements where each of the substrate holders in the substrate holderassembly has integral positioning features that cooperate with matingfeatures of each of the vertical guides. The holder assembly 586 may bethe number of substrate holders coupled to a frame 946 (See FIG. 28A),where the frame may be an end effector coupled to a transporter andwhere the transporter is configured to move the substrate holderassembly to and from the process module 210, and where the transporteris configured to move a different substrate holder assembly with theholder frame to and from the process module 210. Each of the substrateholders in the substrate holder assembly 586 may be independentlymoveable and positionable relative to the other substrate holders in thesubstrate holder assembly. Each of the substrate holders in thesubstrate holder assembly 586 may be in repeatable alignment withrespect to the predetermined feature of the process section independentof the other substrate holders in the substrate holder assembly 586.Each of the substrate holders in the substrate holder assembly 586 maybe in repeatable alignment with respect to a corresponding processelement in the plurality of process elements and independent of theother process elements in the plurality of process elements. The moduleframe has insertion guides and each substrate holder has mating guidesdepending from each substrate holder and corresponding to the insertionguides, the insertion guides and mating guides being configured so that,on coupling of the substrate holder and the module frame, the insertionguides receive the corresponding mating guides of each substrate holderaligning each substrate holder of the substrate holder assembly inrepeatable alignment with respect to a corresponding process element inthe plurality of process elements. The insertion guides may be verticalguides aligning each of the substrate holders in the substrate holderassembly in repeatable alignment with respect to the correspondingprocess element in the plurality of process elements. The holderassembly 586 may be the number of substrate holders coupled to a frame946, where the frame comprises an end effector coupled to a transporterand wherein the transporter is configured to move the substrate holderassembly to and from the process apparatus, and where the transporter280 is configured to move a different substrate holder assembly with theholder frame to and from the process apparatus. Each of the substrateholders in the substrate holder assembly 586 may be in repeatablealignment with respect to the corresponding process element in theplurality of process elements independent of the other substrate holdersin the substrate holder assembly 586.

Referring now to FIG. 13, there is shown a single wafer holder 360.Holder 360 is shown having handle section 362 and wafer section 364.Handle section 362 has crossbar 366 that couples left and right flexures368, 370 of wafer section 364. Left fingers 372 and 374 are showncoupled to left flexure 368. Right fingers 376, 378 are shown coupled toright flexure 370. Referring also to FIG. 15A, wafer 380 is shown oncenter with flexures 368, 370 closed and retaining wafer 380 capturedwith fingers 372, 374, 376, 378. Referring also to FIG. 15B, there isshown wafer holder 360 with wafer 380 still on center and with flexures368, 370 opened 382, for example 0.070″ or otherwise. Referring also toFIG. 15C, there is shown wafer holder 360 with wafer 380 moved down, forexample, 0.180″ or otherwise and with flexures 368, 370 opened 382, forexample 0.070″ or otherwise. Here, flexures 368, 370 are shown opened382 with wafer 380 moved down 384 relative to wafer holder 360, forexample, in order to allow translation perpendicular to the Wafersurface with adequate clearance of the wafer holder top finger contacts372, 376. In alternate aspects of the disclosed embodiment, the waferneed not move down to clear the contacts. Here, the support of the waferholder array may be able to move in both Z and X relative to the supportof the Wafers (X being perpendicular to wafer surface here). The top tobottom asymmetric open position of the flexure wafer holder with regardto load/unload is overcome relatively easily in the loader and gains thesimplicity and rigidity of the wafer holder array in the remainder ofthe system. Referring also to FIG. 15D, wafer 380 is shown on centerwith flexures 368, 370 but offset perpendicular to the view such thatthe fingers do not capture wafer 380. Here, flexures 368, 370 are in arelaxed state and closed inside the edges of wafer 380 with wafer 380not captured with fingers 372, 374, 376, 378. The flexure frame may bemade from stainless steel SS316, PEEK or any suitable material. Here,flexure based motion may be used to load and grip wafers as an assemblyfor showing wafer position relative to the wafer holder in its deflectedstate. FIG. 15A image shows the beam in a wafer holding state whereasFIG. 15B shows 0.070″ exemplary deflection of the 2.5″ long or otherwiseflexure, which may be sufficient to clear the capture rim for the uppercontact block and causes the wafer to fall out of the lower contactblock. This type of actuation may require either (1) the load station toprovides support to the wafer prior to opening the flexure/contact-blockassembly or (2) the lower contact blocks to have a more extensivesurface on the rear side of wafer to support it when the flexure isdeflected open. Flexure wafer holding mechanism or wafer holder 360holds and retains substrate 380 during vertical fluid processing of asurface of the substrate where holder 360 has a frame with a supportmember 355 and with first leg 368 and second leg 370 coupled to frame366 and depending from the support member with first compliant flexure384 and second compliant flexure 386 respectively. Here, first andsecond compliant flexures are configured so that at least one of thelegs is movable relative to the other. First leg 368 is shown havingfirst contact fingers or members 372, 374 that are shown engaging afirst edge 388 of substrate 380. Second leg 370 is shown having secondcontact fingers or members 376, 378 adapted to engage second edge 390 ofsubstrate 552 so that substrate 380 is supported by the legs. Inalternate aspects of the disclosed embodiment, more or less contactfingers may be provided, for example a single contact finger on one legand multiple contact fingers on the opposing leg. Upon deflection of thefirst and second compliant flexures, the first and second legs aremoveable in substantially opposite directions disengaging the first andsecond contact fingers from the first and second edges of substrate 380.Here, upon deflection of the first and second compliant flexures, therelative movement between first and second legs effect engagement anddisengagement of the first and second contact members from the first andsecond edges of the substrate. In the embodiment, the flexure waferholding mechanism touches the wafer 380 at several points on theperimeter of wafer 380 such that the holding force may be fail-safe,simple and compact. Here, fail-safe may refer to transporting of 360throughout an automated system with little risk of dropping or damagingwafer or substrate 380. Here, simple may refer to simplicity of thesubstrate engagement mechanism as well as the capability to enableganging a plurality of wafer holders into a batch, for example a six orotherwise wafer holder batch, to provide higher throughput of wafersthrough the process tool. Here, compact may refer to enabling thevarious fluid processing mechanisms to approach very close to the wafersurface without being obstructed by the wafer holding mechanism, forexample to enable a SHEAR PLATE agitation mechanism to work at adistance of 0.5 mm from the wafer surface or alternately any othersuitable mechanism, distance or otherwise. Substrate holder 550 may beused in conjunction with any suitable fluid processing mechanisms, forexample, and may include a fluid nozzle array, a nitrogen air knife anda Marangoni drying nozzle assembly or otherwise. In the disclosedembodiment, flexure wafer holder 360 may be used to provide precisionlocation and movement of the wafer relative to these fluid or gasprocessing elements while taking advantage of vertical orientation toprovide advantageous fluid flow. Thus the designation for the waferholder as a Precision Aligned Carrier (PAC) wafer holder. In theembodiment, the contact fingers may be asymmetric so that fluid processelements may be positioned nearer the front surface of wafer 380 thanthe back side, for example within 0.5 mm or otherwise of the frontsurface of the wafer. In the embodiment shown, wafer holder legs 368,370 may provide some separation distance from the handle 368 or crossbarso that the wafer 380 may be immersed into a fluid bath without wettingthe handle. Legs 368, 370 may be opened and closed to allow forinsertion and removal of wafers as covered in more detail below. Aloading actuation mechanism (not shown) separates legs 368, 370 forexample by pushing against the inner surface of the lower part of eachleg to spread the legs away from the wafer holder centerline such thatthe flexures 384, 386 connecting the leg to the handle are deflectedsufficiently to allow the wafer 380 to be moved out of the contactfinger surfaces. When the wafer holder legs are in a closed position asshown in FIG. 15A, the four contact fingers 372, 374, 376, 378 define acircle that is approximately the same diameter as the wafer and thiscircle may be considered as defining the nominal centerpoint datum ofthe wafer holder to which the wafer center is aligned when it iscaptured by wafer holder 360. When the wafer holder legs are deflected,the four contact fingers define a second circle that may be severalmillimeters or otherwise larger than the diameter of the wafer and forwhich the center of this second circle may be displaced severalmillimeters away from datum center due to the deflection of the flexureleg combination; if the wafer is translated such that its center alignswith the second circle center the wafer 380 may be lifted out of thecontact fingers and removed from the wafer holder 360. In alternateaspects of the disclosed embodiment, the flexure design of the waferholder may be such that the first and second circle centerlines may besubstantially the same such that wafer extraction does not employrelative translation between wafer and holder during insertion orextraction from holder 360. One aspect of the disclosed embodiment isthe detailed shape of the wafer capture surfaces on the contact fingersand the manner in which the motion of the wafer during load and unloadenables the holding mechanism to be very secure and yet have minimalcontact to the wafer surface and cause minimal dripping or otherunwanted fluid processing artifacts, as described in more detail below.In the embodiment shown either a load station may be used to providesupport to the wafer prior to opening the flexure/contact-block assemblyor alternately the lower contact blocks 374, 378 may be provided with amore extensive surface than shown in FIG. 14, for example, on the rearside of wafer 380 to support the surface when the flexure is deflectedopen. As seen in FIG. 15C, by offsetting the wafer 380, for example, by0.180″ inches vertically, approximately centering it in the opening ofthe contact blocks (when the flexures are deflected by 0.070″ orotherwise) the wafer now has, for example, 0.11″ clearance to thecapture sections, and still is above the rear support surface. Thismotion in a load station may be as follows: 1. Insert WH-Array 360vertically using Transporter 280. 2. Rotate cradle to 10 degrees offvertical so that wafer is biased by gravity against rear surfaces of theContact-Blocks. 3. Apply 10 Nts of force to bend the flexure legs of theWH (i.e open them part way) which will cause the wafer to slide downwardin Z by 0.18″, while being stopped by the lower Contact-Blocks, andtilting backward against the rear of the upper Contact-Blocks. 4. Move aLoad-Station vertical lift element upward by 0.2″ to support wafer in Zdirection (this is only a pair of bars parallel to wafer axis to contacton the wafer edge, while not obscuring the end effector insertion) atthis point the wafer is weakly constrained in Z at the top so someover-travel will be tolerated. 5. Apply 20 Nts of force to bend flexurelegs to open position, this may provide 2.5 mm clearance for wafer toeach of the Contact-Block front capture rims, so that wafer 360 hasadequate clearance to be lifted out along its axis. 6. Rotate cradle tohorizontal; wafers are weakly constrained from moving upward in Zdirection by the sloped surfaces of the Contact-Blocks. 7. Use a simpleend effector for get and put motions to pick-up the finished wafer andreplace with a new wafer. As will be described, in alternate aspects ofthe disclosed embodiment, the Load Station could include an interleavedset of pallets, with 3 points of contact at the wafer perimeter, whichlift after the WH-Array is vertically inserted and rotated to horizontalsuch that wafer drops onto the contact points when flexures are opened;when flexures close the angled backside surface of Contact Blocks liftthe wafer into the grip surfaces of the wafer holder 550. In FIG. 14,there is shown a view of lower contact block 378 having an edge wafersupport surface 550 that contacts an outer peripheral edge 390 ofsubstrate 380. Lower contact block 378 further has a first supportingportion 552 that contacts a first surface 380′ at an outer peripheraledge on the surface of substrate 380. Lower contact block 378 furtherhas a second supporting portion 554 that contacts a second surface 380″opposing the first surface at an outer peripheral edge on the surface ofsubstrate 380. Wafer contact feature 378 is shown designed to not trapfluids when raised out of one of the process modules, for example, aMarangoni or shear plate agitation module, where any liquid trappedbetween the wafer and the contact can redeposit onto the wafer afterdrying, causing water spots. Here, the two sides of the wafer may bespaced 553, 555 more than a capillary length (2 mm) so thatgravitational force exceeds the surface contact force, and the fluiddrips back into the bath rather than staying with the raised PAC. PACwafer contacts, for example contact fingers 372, 374, 376, 378 may becomposed of a material hard enough not to wear away upon contact withthe sharp edge bevel, but soft enough to not wear away the Si wafer,thereby preventing particle generation. One exemplary material is PEEKor any suitable alternate. In this manner, each finger 372, 374, 376,378 in combination retain substrate 380. In alternate aspects of thedisclosed embodiment, the fingers may have features such as angledportion(s) with respect to the surface(s) of wafer 380, for example, sothat when supporting the wafer in an open position, only the outerbottom or back edge of the wafer contacts the surface, and so thatwafers may be supported in a horizontal orientation by holder 360 whenholder 360 is open. In alternate aspects of the disclosed embodiment,tapered surface(s) may be provided and angled with respect to surface(s)of wafer 380 and may contact an outer edge of the wafer, for example, inthe clamping and capture of a warped wafer or otherwise. The length andsize of portions 552, 554 may be minimized to minimize interaction withfluid processing of the front side of wafer 380. In alternate aspects ofthe disclosed embodiment, a radius nose may further be provided toprevent wafer hang up or otherwise. Alternately any suitable contactblock geometry may be applied alone or in any suitable combination. Asseen in FIG. 13, contact block or finger 378 may be a removable contactblock. Here, two 3 mm or other suitable pins may position theContact-Block and redundant M2.5 mm flat-head screws 556, 558 or othersuitable fasteners may hold block 378 in place. The frame of flexure 370may be cut from 316-Stainless Steel and annealed and Blanchard groundflat and parallel prior to water jet cutting and milling of theattachment surfaces. Alternately, any suitable material or fabricationtechnique may be used. The legs 368, 370 of flexure based holder 360 maybe sufficiently wide, for example, to provide lead-in and wheel rollingsurfaces sufficiently far from the wafer or process chemistry. The massof assembly 360 may be 2.3 lbs. or otherwise and may be minimized with acenter of gravity near the top of wafer 380. Here, tapered surfaces 560,562, 564 may be provided and are shown on the lower end of holder 368,370 legs (front, rear, side), for example, to facilitate the alignmentof wafer holder 360 to guide features in fluid process modules as willbe described and shown in greater detail below. In the disclosedembodiment, holder 360 provides structure for aligning wafers to processfluid elements. To enable parallel single wafer processing, awafer-Holder may accomplish several functions: Fail safe holding ofwafers precisely with respect to reference surfaces in process modules;Enablement of wafer loading and unloading; Enablement of the transportof an array of wafer holders in parallel with sufficient high precisionlocating in multiple process modules; and vertical processing withminimal drips. Simultaneous dual wafer size, for example, 300 mm and 200mm may be provided by positioning the 200 mm wafer at the bottom of thewafer holder (i.e. so that the bottom edges of 200 mm and 300 mm aretangent) so that the loader mechanism for 200 mm doesn't interfere withthat of 300 mm the motion distance for opening the wafer holder, whichmay be different for 300 and 200 mm sizes. Similarly, outside dimensionsof the 300 mm and 200 mm holders may be identical so the same shearplate or other process nests may be used for both 200 and 300. In theembodiment shown, a soft pad contact may be provided with additionalfeatures, for example, a third edge grip or to increase the captureinterference to contain flexible or fragile wafers or substrates. In theembodiment shown in FIG. 14, holder 360 employs separate radial andaxial wafer contact surfaces into distinct elements rather than using acombined “V-groove” type of feature providing alignment as discussed ingreater detail below and supporting future capabilities such as a waferedge clean or otherwise. As will be described, a perfluroelastomer padmay be used for wafer radial contact, avoiding high point contact forceand associated particle generation from abrasion; here safe handling ofsilicon/glass bonded wafers or other fragile substrates may be provided.Here, the elastomer pad may be molded onto the contact fingers. Thin,approximately 2-3 mm or other suitable sized finger elements 372, 374,376, 378 with attachment features outside of a 310 mm or other suitablywide travel zone 566 needed for the Marangoni nozzles or other processelements may be provided, thereby allowing for closer uniform approachof the linear Marangoni or other nozzles. Axial restraint features maybe machined directly into these parts in order to avoid a junction whichmay initiate drips. Holder 360 may be constructed from multiple piecespinned, and/or heat shrunk fitted together or other suitablemanufacturing technique may be provided. In the embodiment shown,different geometry is provided for the top 372, 376 and bottom 374, 378fingers so that drips are pulled downward by gravity away from the wafer380. In the embodiment shown, side flexure legs 368, 370 may be separateelements from a top cross bar 368. Referring also to FIG. 16A, there isshown finger 378′. Finger 378′ has elastomer pad 570 that supports theradial loads where stainless steel has a slot 572 which restrains thewafer position axially (i.e. in/out of the page). Wafer 380 is shownwith resist 574 with 2 mm edge exclusion 576. Here, finger 378′ is shownas a lower or bottom finger staying within the edge exclusion zone.Referring also to FIG. 16B, there is shown finger 376′. Top contactfinger 376′ is shown having different geometry 578 which allows fluiddrips to flow downward away from wafer 380. A minimal fingercross-sectional contact area at the wafer minimizes the volume of fluidheld by surface tension forces. In the embodiment shown, there isclearance in wafer thickness direction in the SS or PEEK finger elementswhere this clearance may be tight enough to avoid the wafer motionduring processing, for example, due to interaction with ShearPlateagitation member induced fluid motion. Lead-in may be provided inportions of the contact fingers, for example, reduced to about ½ mmwhich can be tolerated by using the exchange Loader mechanism where thewafer may be positioned precisely by the loader gripper such thatclearances may not need to be replicated into wafer holder 360, therebyallowing for closer proximity of the process elements, for example shearplate and Marangoni process elements or otherwise.

Referring now to FIG. 17, there is s shown an array of wafer holders586. Referring also to FIG. 18A, there is shown a partial view of waferholder 360. Referring also to FIG. 18B, there is shown a partial view ofwafer holder 360. Individual wafer-holders 360 are not attached to eachother to form a “batch” 586, instead they are temporarily formed into a“batch” by the actuation of the transporter which lifts, transports, anddeposits a “virtual array” 586 of wafer holders 586 from one processstation to the next in the tool. A number of features on wafer holder360 enable appropriate transport as a virtual array 586 and precisionalignment of individual wafers to process elements within modules. Here,the transporter lifts and supports the array 586 in Z. During transport,accelerations are in Y (parallel to Wafer surface) so resulting primarytorque due to offset of center of gravity from the lift surfaces is wellstabilized, for example, by the 15″ or other suitable width 588 of thewafer holder 360. During transport, particularly lift and descend,torques 590 need to be stabilized and there is little leverage to do sosince wafer holder array pitch 592 is 1.5″ or otherwise. As such, afeature 594 may be provided on each holder 360 that uses most of this1.5″ length. A Lower region lead-in near to SP (shear plate) agitationmember or LINEW (Marangoni) surfaces may be provided, for example, byextending lower edge of legs 368, 370. An upper region lead-out, orstabilization may be provided, for example, that keeps the wafer holderaligned in the Marangoni LINEW array lifter element. Top-Block 594 isshown having a broad plate that allows for both pick-up by Transporter,and is used to stabilize the wafer holders during transport where thepick-up mechanism may clamp the wafer holder up into a fixed plate.Clamping can be tight during linear accelerations and looser duringdescent and ascent from process modules, thereby avoiding overconstraint and allowing the wafer holder 360 to find its precise placein the given processing module or transport module. A second feature onthe Top-Block 594 may be a horizontal stub 596 that supports the waferholder weight in the process module, this limits the down position sothat the higher plate feature 594 is accessible to the Transporter forpick-up and put-down. The top surface of this stub 595 may be used inSP-Modules to clamp the wafer holder 360 downward to resist shear plateagitation member drag forces caused by agitation.

In accordance with another aspect of the disclosed embodiment, substrateholder 360 is adapted to hold and retain a substrate 380 during verticalfluid processing of a surface of the substrate. Wafer holder 360 has aframe 366 and a first leg 368 coupled to the frame by a first compliantflexure, the first leg having a first contact member configured toengage a first edge of the substrate. Second leg 370 is coupled to theframe by a second compliant flexure, the second leg having a secondcontact member configured to engage a second edge of the substrate. Upondeflection of the first and second compliant flexures, the first andsecond legs 368, 370 are moveable in substantially opposite directionsdisengaging the first and second contact fingers from the first andsecond edges of the substrate respectively. The first contact member maybe first and second contact fingers engaging different portions of thefirst edge of the substrate. The first contact member may comprise first550, second 552 and third 554 contact points, the first contact pointengaging the first edge of the substrate, the second contact pointengaging the surface of the substrate, the third contact point engaginganother surface of the substrate on an opposite side of the substrate.The first and second legs 568, 570 are moveable in the same plane. Thefirst and second legs may further be first and second integralpositioning features configured to cooperate with a mating locatingfeature. The first and second legs may further be first and secondleading tapered edges 560 configured to engage with a mating locatingfeature. The first compliant flexure may be first and second flexureelements, the first flexure element substantially parallel to the secondflexure element. A handling feature 594 may be coupled to the frame, thehandling feature having a holder transporter interface surfacesubstantially perpendicular to the first and second legs.

Referring now to FIG. 19, there is shown an isometric view of loadermodule 808. Referring also to FIG. 20, there is shown a side view ofloader module 808. Referring also to FIG. 21, there is shown a side viewof loader module 808. In the disclosed embodiment, loader 808 hasshuttle 910 where shuttle stage 910 may have roughly a 1″ travel in Xdirection for a single Shuttle 808 whereas adding a second Shuttle 808′,for example, for higher throughput, so that one shuttle may beload/unloaded while the other is doing an array transfer; this wouldrequire both Shuttles to have about 20″ travel for a 6 wafer array 818.Here, loader 808 receives wafer holder-Array 586 into framework 916which has the requisite motion to open the wafer holder flexure 818,where this “wishbone” motion may be about 0.070″ symmetric about waferholder (WH) 818 center and Shuttle 910 center line (i.e. a total of0.14″ motion.) In the embodiment shown, elements of “Array ExchangeLoader” 808 are shown for a 6 wafer array 586 size. In alternate aspectsof the disclosed embodiment, any suitable number may be provided. Loader808 has shuttle 910 having an array of Compliant wafer Gripper (CWG)elements 920, one for each input and output position, mounted on alinear bearing 922 mounted to the base plate 924. Wafer holder dock 916receives the WH-Array 586 and makes a pivot motion 930, 932 of severaldegrees to open the WH's for exchange, and makes a vertical translation936 of 4 to 6 mm to center the WH open finger position on theCWG-Gripper. Here, wafers are extracted and inserted in a supinated(i.e. vertical) orientation through slots in the sidewalls of the waferholder dock 916. Transporter gripper plate 946 is also shown. In FIG.20, WH-Array 586 is shown supported by the Loader and Transporterelements in an open position as would be the case immediately afterdrop-off or before pick-up of the WH-Array 586. In FIG. 21, the WH's 586are shown opened and positioned so that the Shuttle/CWG-Gripper assembly910/920 can move perpendicular to the wafer surfaces for transferbetween CWG-Gripper and WH elements, as shown in more detail in thetable of FIGS. 24A-M and FIGS. 25A-E. Side elements of the WH-Dock 916may pivot to make this motion, and the WH-Dock may be lifted by 4-6 mmto move the WH-Array fingers in the open position onto center with theWafers in the CWG-Grippers 920 on the Shuttle 910. Here, a more detailedsequence of moves within the loader is given in the table of FIGS. 24A-Mand FIGS. 25A-E. Referring also to FIGS. 22B and 22A, a quick parallelexchange is shown with completed processed wafers being inserted intothe Loader-Shuttle and outgoing un-processed wafers being removed by theWH-Array. Here, the Shuttle-array positions are two for CWG-Grippers andone empty for WH's. These positions split up the array pitch ofapproximately 1.5″, they are referred to as “A” for the outgoing orprocessed wafers, “B” for the incoming or un-processed wafers, and “C”are not populated with CWG-Gripper elements, these are positions intowhich WH-Array elements are inserted. During the exchange process theShuttle moves approximately plus or minus 0.75″ inch horizontally. TheWH-Array is moved vertically by the Transporter by approximately 20″ toenter and exit the WH-Dock which surrounds the Wafer-Gripper arrays.

Referring now to FIG. 22A, there is shown a batch exchange loader 400transferring 6 processed wafers 402 from holder array 324′ to shuttlearray 320′. Referring also to FIG. 22B, there is shown a batch exchangeloader 400 transferring 6 un-processed wafers 404 from shuttle array320′ to holder array 324′ after transferring 6 processed wafers 402 fromholder array 324′ to shuttle array 320′. Here, loader 400 may havefeatures as described with respect to loader 808 and array 324′ may havefeatures as described with respect to array 586. Here loader 400 maytransfer substrates as will be described in a “fast swap” manner betweenshuttle array 320′ and holder array 324′. In the embodiment shown,loader 400 has shuttle array 320′, shuttle axis 410, a cradle or supportfor capturing wafer holder array 324′, an actuator for expanding theflexures of holder array 324′ and actuators for expanding the waferclamping features of shuttle array 320′. In each case, loader 400 mayselectively grip one or more wafers with either wafer holder array 324′or shuttle array 320′, for example, as will be described with respect toa unload and load sequence below. Loader 400 may receive wafer holderarray 324′ into a framework which has the requisite motion to open thewafer holder flexure, for example, a “wishbone” motion of about 0.070″or otherwise symmetric about the wafer holder center and Shuttle centerline (i.e a total of 0.14″ motion.). Here, FIG. 22A and FIG. 22B showisometric views of the main elements of “Batch Exchange Loader” for a 6wafer batch size where FIG. 22A shows completed processed wafers 402being inserted into the Loader-Shuttle 400 and FIG. 22B shows outgoingun-processed wafers being removed by wafer holder array 324′. Wafers 402indicate outgoing processed, or stripped, wafers and wafers 404 indicateincoming wafers, for example, with photo-resist that will be stripped inthe process section of the tool. Shuttle-array 320′ has 6 positions “A”that are used for the outgoing or processed wafers 402. Shuttle-array320′ further has 6 positions “B”, interleaved with the 6 positions “A”,that are used for the outgoing or processed wafers 404. In alternateaspects of the disclosed embodiment, “A” may be used for incoming orunprocessed wafers. In alternate aspects of the disclosed embodiment,more or less positions may be provided. Here, loader 400 is providedadapted to unload wafers and load wafers to an array of wafer holders324′. In the embodiment shown, loader 400 has first and second exchangeholder arrays 320′ “B” and 320′ “A”, each having exchange holdersalternating and interleaved with respect to each other. Here, firstexchange holder array 320′ “B” has load or incoming wafers and the arrayof wafer holders 324′ has unload or outgoing wafers. The unload wafersare moved as a group from the array of holders 324′ to the secondexchange holder array 320′ “A” and the load wafers are moved as a groupfrom the first exchange holder array 320′ “B” to the array of holders324′ as will be described. In the embodiment shown, a six elementWafer-Holder-Array (WH-Array) 324′, also known as a Precision AlignedCarrier (PAC) Array may be suspended from a Transporter (not shown) andtwo arrays of Wafer-Grippers “A” and “B” of shuttle array 320′, one forinput and one for output wafers, is carried on a Shuttle mechanism 410(not shown) below. During the exchange process the Wafer-Gripper/Shuttle320′, 410 moves approximately one inch or otherwise horizontally whilethe WH-Array may be moved vertically by the transporter or otherwise byapproximately 20″ or otherwise to enter and exit the envelope occupiedby the Wafer-Gripper arrays. The Wafer-Grippers may hold the wafers in arelatively precise position, for example the wafer may be positionedwithin an envelope of approximately +−0.4 mm from an ideal centerposition. Additionally, each Wafer-Gripper may hold the wafer with somecompliance so that during the exchange step where the wafer is contactedby both the wafer holder and a Wafer-Gripper of shuttle 320′, there isnot any considerable force applied to the wafer due to small inherentmisalignments between the two sets of contact surfaces. Such grippersare designated Compliant Wafer Grippers (CWG). Shuttle 320′ may beprovided with 12 wafer-gripper mechanisms 420, for example, as describedin U.S. Pat. No. 6,174,011 which is hereby incorporated by reference inits entirety. In alternate aspects of the disclosed embodiment, anysuitable wafer gripper mechanism may be used. The gripper mechanism alsomay be actuated from one end, for example, as shown here the lower endof the Wafer-Gripper which is mounted in the Shuttle (not shown) where asingle actuation provides accurate motion of grip features due todeflection of a flexure system of the wafer-gripper. As will bedescribed with respect to FIGS. 24-25, a batch exchange procedure occursafter the Shuttle 320′ “B” positions have been loaded by the front-endwafer robot (which simultaneously would remove any finished wafers fromthe Shuttle 320′ “A” positions) and the wafer holder array 324′ has beenprocessed through the tool wet processing and drying section. Here,wafers are transferred to and from the Loader by a commerciallyavailable wafer-robot in the front end of the tool with an edge gripend-effector and supination capability, which is the capability torotate the wafer from horizontal orientation in the incoming cassette orFOUP to a vertical orientation suitable for insertion into theWafer-Gripper/Shuttle 320′. For high speed systems a commerciallyavailable wafer-robot with two such end-effectors would be used. Inalternate aspects of the disclosed embodiment, simultaneous dual wafersize, for example, 300 mm and 200 mm or otherwise capability may behandled by positioning the 200 mm wafer at the bottom of the waferholder (i.e. the bottom edge where 200 mm and 300 mm wafers are tangent)so that the Loader mechanism for 200 mm doesn't interfere with that of300 mm. The motion distance for opening the wafer holder may bedifferent for the 300 and 200 mm sizes. Here, outside dimensions may besubstantially similar or identical so the same shear plate nests,Marangoni dryer components or other process or post process componentsmay be used for both 200 and 300 mm sizes.

Referring now to FIG. 23A, there is shown a cross section of a processtool 300 through a process area 308. In the embodiment shown,transporter 326 transports PAC wafer holder array 324 to and fromexemplary process module 340. Process module 340 may have moveableheated covers 430 (shown open) that close above the fluid level 434 ofprocess module 340 and below the crossbar(s) 432 of wafer holder arrayshown as 324′ in a fluid processing position where heated covers 430 areprovided to prevent condensation, for example, on the wafer holder arrayor otherwise. Filter fan unit 438 may be provided within enclosure 442of system 300 to maintain a clean mini environment where, for example,transporter region 436 may be provided to house moving components oftransporter 327 and exhausting air there from through exhaust plenum440. Referring now to FIG. 23B, there is shown a cross section of anexemplary batch exchange loader 400. Loader 400 may have shuttle array320′, wafer holder array support 460 and shuttle 464. In the embodimentshown, shuttle array 320′ is capable of holding both processed andunprocessed wafers as described above. In alternate aspects of thedisclosed embodiment, shuttle array 320′ may be only capable of holdingeither processed or unprocessed wafers. Alternately, shuttle array 320′may not be provided, for example, where wafer holder array 324′ iscapable of being shuttled, for example, to an input or output locationand wafers transferred directly by the wafer handling robot to and fromwafer holder array 324′ directly without the use of an intermediateshuttle array. In the embodiment shown, shuttle 464 is shown as a singleshuttle. In alternate aspects of the disclosed embodiment, a second ormore shuttle(s) may be provided on the same or different axis of motion,either coupled or independently and selectably positionable and operableand capable of handling an additional shuttle array, an additional waferholder array or otherwise. Further, in alternate aspects of thedisclosed embodiment, shuttle 464 may be provided with the capability toselectably re-orient shuttle array 320′, wafer holder array 324′ orotherwise to any suitable orientation, for example, from vertical tohorizontal or otherwise. Transporter 326 may transport wafer holderarray 324′ to and from loader 400 where loader 400 may be provided withfeatures to load and unload wafers to and from wafer holder array 324′in conjunction with transporter 326, for example, where transporter 326is used for vertical motion and holding wafer holder array 324′stationary relative to the shuttle or shuttle array during transfer. Inalternate aspects of the disclosed embodiment, loader 400 may operateand be capable of transferring wafers to and from wafer holder array324′ independent of transporter 326, for example, where transporter 326may be transporting other PAC wafer holder array(s) from process toprocess or otherwise in parallel with operation of loader 400 loadingand/or unloading substrates to or from substrate holder array 324′.Transporter 326 may have gripper portion 470 having first and secondgrippers 472, 474 actuated by actuator 476 where actuator 476 mayselectively grip or release a wafer transport array. Gripper portions472, 474 may have any suitable gripping features 478, 480 that engagemating features 482, 484 in wafer holder array 324′. Gripper portions472, 474 and gripping features 478, 480 may be rigid or compliant asrequired and may have lead in features, pin and socket features or anysuitable feature to positively locate gripper 470 relative to a waferholder array. Support 460 may be provided, for example, wheretransporter is not required during a wafer batch exchange where support460 may be grounded to frame 480 or moving shuttle 464. One or two axisactuators 482, 484 may be provided to move support 460 vertically,horizontally or otherwise to support a batch transfer of wafers, forexample independent of or in conjunction with transporter 326 whereactuators 482, 484 may be grounded to frame 480 or moving shuttle 464.Lead in features 486, 488 may be provided in support 460 to facilitateguidance of wafer holder array 324′ during insertion or otherwise.Clamps (not shown) may be provided to positively couple wafer holderarray 324′ to support 460. Actuators 490, 492 may be provided toselectively release or grip wafers with wafer holder array 324′ whereactuators 490, 492 may be grounded to support 460, frame 480 orotherwise. Shuttle 464 may be grounded to frame 480 having slides 494,498, shuttle support table 500 and drive 502 where drive 502 may be alead screw drive or any suitable linear drive that may selectableposition table 500 with respect to ground 480. Shuttle array 320′ may besupported directly by shuttle table 500 and may have actuator(s) 406that selectively grip or ungrip one or more wafers (may be individuallyor as a group) with respect to shuttle array 320′. In alternate aspectsof the disclosed embodiment, shuttle array 320′ may be supported byintermediate support 510 that may be moveable relative to shuttle table500, for example, with actuators 512, 514 that may be one or two axisactuators, for example vertical and/or horizontal to facilitate batchtransfer of wafers. In alternate aspects of the disclosed embodiment,any suitable combination of supports, actuators or otherwise may be usedto facilitate batch transfer of wafers. Referring now to FIG. 23C, thereis shown a cross section of a PAC wafer holder 324′ cross bar 432. Inthe embodiment shown, cavities may be provided to reduce weight andsmoothed drip minimizing surfaces may be provided to minimize potentialfor dripping, Further, coatings may be provided to eliminate or reducecondensation to prevent carrying condensate from one process to another.Potential drip surfaces further may be offset, for example, offset fromthe wafer surface or otherwise.

In accordance with another aspect of the disclosed embodiment, asubstrate unload and load apparatus 400 adapted to unload a plurality ofprocessed substrates from a plurality of arrayed substrate holders andload a plurality of unprocessed substrates to the plurality of arrayedsubstrate holders is provided. The substrate unload and load apparatus400 has a frame and a plurality of processed substrate supports “A”coupled to the frame and configured to support the plurality ofprocessed substrates. A plurality of unprocessed substrate supports “B”are coupled to the frame and configured to support the plurality of unprocessed substrates. Each of the plurality of unprocessed substratesupports are alternating and interleaved with respect to each of theplurality of processed substrate supports. A holder release 490, 492 iscoupled to the frame and configured to engage the plurality of arrayedsubstrate holders. The holder release has a first state where theplurality of arrayed substrate holders releases the plurality ofprocessed substrates from the plurality of arrayed substrate holders.The holder release has a second state where the plurality of arrayedsubstrate holders captures the plurality of un processed substrates withthe plurality of arrayed substrate holders. The plurality of processedsubstrates are unloaded from the plurality of arrayed substrate holdersto the plurality of processed substrate supports in the first state. Theplurality of unprocessed substrates are loaded from the plurality ofunprocessed substrate supports to the plurality of arrayed substrateholders in the second state. The plurality of processed substrates areunloaded from the plurality of arrayed substrate holders while in avertical orientation. The plurality of unprocessed substrates are loadedto the plurality of arrayed substrate holders while in a verticalorientation. The plurality of processed substrate supports and theplurality of unprocessed substrate supports are coupled to the framewith an indexer, where the indexer simultaneously moves the plurality ofprocessed substrate supports and the plurality of unprocessed substratesupports from a first position where the plurality of processedsubstrates are unloaded from the plurality of arrayed substrate holdersto a second position where the plurality of unprocessed substrates areloaded to the plurality of arrayed substrate holders. The holder releasedisengages substrate edge support members of the plurality of arrayedsubstrate holders from edges of the plurality of processed substrateswhen in the first state. The holder release engages the substrate edgesupport members to edges of the plurality of unprocessed substrates whenin the second state. Each of the plurality of unprocessed substratessupported by the plurality of unprocessed substrate supports arealternating and interleaved with respect to each of the plurality ofprocessed substrates supported by the plurality of processed substratesupports. Each of the plurality of unprocessed substrates supported bythe plurality of unprocessed substrate supports are axially aligned withrespect to each of the plurality of processed substrates supported bythe plurality of processed substrate supports. Edges of the plurality ofunprocessed substrates are supported by the plurality of unprocessedsubstrate supports, where edges of the plurality of processed substratesare supported by the plurality of processed substrate supports. Theplurality of processed substrates are simultaneously unloaded as aprocessed substrate group from the plurality of arrayed substrateholders to the plurality of processed substrate supports in the firststate. The plurality of unprocessed substrates are simultaneously loadedas a unprocessed substrate group from the plurality of unprocessedsubstrate supports to the plurality of arrayed substrate holders in thesecond state. A plurality of holder supports are coupled to the frameand configured to support and align each holder of the plurality ofarrayed substrate holders independent of the other holders in theplurality of arrayed substrate holders.

Referring now to FIGS. 24A-24M, there is shown an exemplary loadsequence. Referring now to FIG. 24A, there is shown a side view ofholder array 324′ and shuttle array 320′. Here, the motion and stateincludes vertical motion downward by PAC WH-Array 324′ into the Shuttle320′ and shown for example, 1 inch above the Z aligned position. Here,the WH-Array 324′ is shown full with outgoing wafers and contactsurfaces closed. Here, Shuttle-A positions are shown empty with contactsurfaces in open position and Shuttle-B positions are shown full withincoming wafers with contact surfaces in closed position. Referring alsoto FIG. 24B, there is shown a side view of holder array 324′ and shuttlearray 320′. Here, the motion and state includes vertical motion downwardby WH-Array 324′ into the Shuttle 320′ and shown in Z aligned position.Here, the PAC WH-Array 324′ is shown full with outgoing wafers andcontact surfaces closed. Here, shuttle-A positions are shown empty withcontact surfaces in open position and Shuttle-B positions are shown fullwith incoming wafers with contact surfaces in closed position. Referringalso to FIG. 24C, there is shown a side view of holder array 324′ andshuttle array 320′. Here, the motion and state includes horizontalmotion by Shuttle 320′ to align “A” positions with WH-Array 324′ wafers.Here, WH-Array 324′ is shown full with outgoing wafers and contactsurfaces closed. Here, Shuttle-A positions are shown full with contactsurfaces in open position and Shuttle-B positions are shown full withincoming wafers with contact surfaces in closed position. Referring alsoto FIG. 24D, there is shown a side view of holder array 324′ and shuttlearray 320′. Here, the motion and state includes Shuttle “A” positionflexures closed on the outgoing wafers. Here, WH-Array 324′ is shownfull with outgoing wafers and contact surfaces closed. Here, Shuttle-Apositions are shown full with contact surfaces in closed position andShuttle-B positions are shown full with incoming wafers with contactsurfaces in closed position. Referring also to FIG. 24E, there is showna side view of holder array 324′ and shuttle array 320′. Here, themotion and state includes WH-Array 324′ flexures open to release theoutgoing wafers. Here, WH-Array 324′ is shown full with outgoing wafersand contact surfaces opened. Here, Shuttle-A positions are shown fullwith contact surfaces in closed position and Shuttle-B positions areshown full with incoming wafers with contact surfaces in closedposition. Referring also to FIG. 24F, there is shown a side view ofholder array 324′ and shuttle array 320′. Here, the motion and stateincludes where WH-array 324′ moves up, for example, 0.180″ to allowshuttle 320′ to move outgoing wafers past its contact surfaces. Here,WH-Array 324′ is shown empty with contact surfaces opened. Here,Shuttle-A positions are shown full with outgoing wafers with contactsurfaces in closed position and Shuttle-B positions are shown full withincoming wafers with contact surfaces in closed position. Referring alsoto FIG. 24G, there is shown a side view of holder array 324′ and shuttlearray 320′. Here, the motion and state includes where Shuttle 320′ moveshorizontally to align incoming wafers with WH-Array 324′ contactsurfaces. Here, WH-Array 324′ is shown empty and up with contactsurfaces opened. Here, Shuttle-A positions are shown full with outgoingwafers with contact surfaces in closed position and Shuttle-B positionsare shown full with incoming wafers with contact surfaces in closedposition. Referring also to FIG. 24H, there is shown a side view ofholder array 324′ and shuttle array 320′. Here, the motion and stateincludes where WH-Array 324′ moves downward, for example, by 0.180″ toalign with Shuttle 320′. Here, WH-Array 324′ is shown empty and downwith contact surfaces opened. Here, Shuttle-A is shown full withoutgoing wafers with contact surfaces in closed position and Shuttle-Bis shown full with incoming wafers with contact surfaces in closedposition. Referring also to FIG. 24I,J, there is shown a side view ofholder array 324′ and shuttle array 320′. Here, the motion and stateincludes where WH-Array 324′ flexures close to capture incoming wafers.Here, WH-Array 324′ is shown full and down with contact surfaces closed.Here, Shuttle-A positions are shown full with outgoing wafers withcontact surfaces in closed position and Shuttle-B positions are shownfull with incoming wafers with contact surfaces in closed position.Referring also to FIG. 24K, there is shown a side view of holder array324′ and shuttle array 320′. Here, the motion and state includes whereShuttle-B positions contact surfaces open to release incoming wafers.Here, WH-Array 324′ is shown full and down with contact surfaces closed.Here, Shuttle-A positions are shown full with outgoing wafers withcontact surfaces in closed position and Shuttle-B positions are shownfull with incoming wafers with contact surfaces in open position.Referring also to FIG. 24L, there is shown a side view of holder array324′ and shuttle array 320′. Here, the motion and state includes whereShuttle 320′ moves horizontally to allow clearance for WH-Array 324′ tobe extracted. Here, WH-Array 324′ is shown full with incoming wafers anddown with contact surfaces closed. Here, Shuttle-A positions are shownfull with outgoing wafers with contact surfaces in closed position andShuttle-B positions are shown empty with contact surfaces in openposition. Referring also to FIG. 24M, there is shown a side view ofholder array 324′ and shuttle array 320′. Here, the motion and stateincludes where WH-Array 324′ moves vertically out of the Loader andproceeds to process the incoming wafers. Here, WH-Array 324′ is shownfull with incoming wafers and moving upward with contact surfacesclosed. Here, Shuttle-A positions are shown full with outgoing waferswith contact surfaces in closed position and Shuttle-B positions areshown empty with contact surfaces in open position. In alternate aspectsof the disclosed embodiment, the loader may move shuttle array 320′vertically to engage and disengage wafer holder array 324′ instead of,for example, the transporter or otherwise moving wafer holder array 324′vertically. Further, in alternate aspects of the disclosed embodiment,up and down movements of wafer holder array 324 may not be required.

Referring now to FIGS. 25A-25E there is shown a table with the primaryvertical and pivot motions made by the Loader WH-Dock 808 and theWH-Array 818 (586) during a load/unload operation at the wafer level.The table shown in FIGS. 25A-25E may be used in conjunction with thesequence shown in FIGS. 24A-24M as an exemplary sequence of Shuttlemoves used to unload reload a WH-Array.

Referring now to FIG. 26, there is shown a partial isometric view ofshuttle array 320″ of a loader module showing an alternate aspect of thedisclosed embodiment. Referring also to FIG. 27, there is shown apartial isometric view of shuttle array 320″. In the embodiment shown,array 320″ has an array of supports 602, each having three wafersupports 604, 606, 608. Each of the wafer supports has two grooves 610,612 corresponding to A and B positions of shuttle array as previouslydescribed. Wafer supports 604, 606, 608 cooperate to support outgoing612 and incoming (not shown) wafers in a vertical orientation aspreviously described with respect to shuttle 320′ or otherwise aspreviously described. Referring also to FIG. 30A, there is shown apartial front view of a loader module 400 and a holder array 324′.Referring also to FIG. 30B, there is shown a partial front view of aloader module 400 and a holder array 324′. FIG. 30A shows PAC 324′ inthe insert/removal position, whereas FIG. 30B shows PAC 324′ openedwhere the opened PAC has been lifted by 1.5 mm relative to loader module400. This small secondary motion may be required to compensate for thedifference in position between upper and lower wafer contact surfaces,and the horizontal and vertical coupling of their positions duringflexure loading.

Referring now to FIG. 28A, there is shown a isometric view of a holderarray. Referring also to FIG. 28B, there is shown a side view of aholder array. Referring also to FIG. 28C, there is shown a partialisometric view of a holder array. Referring also to FIG. 28D, there isshown a partial side view of a holder array. FIGS. 28A-D show holder818, transporter gripper 946 and process module support 996. Exemplaryfeatures of the interaction between a Transporter 946 and the WH's 950are shown in FIGS. 28A-28D, and listed in more detail in the table shownin FIGS. 29A-29H. Here, transporter pick-up mechanism 946 may includetwo main parts that contact the wafer holders 950; top-plate 1004 fixedto the automation stage of the transporter and pair of Clamps 1008 whichmove relative to the Top-Plate in both vertical and horizontaldirections. Each process station may include a structure 996 to supportWH's 950 and align them to the critical elements within that module, ageneralized support structure 996 is shown as a pair of plates intowhich the WH-Array 586 is deposited or from which it is picked up. Here,individual WH's 950 form a “virtual array” 586 or WH-Array 586, whichwhen carried by the Transporter 946 and the WH's 950 may never actuallybe attached to each other by a fixed means, enabling each wafer to bealigned singly with process elements, for example, Marangoni, shearplate, N2 Air Knife and other or similar components in close proximityto each wafer surface, as will be described in greater detail.

Referring now to FIGS. 29A-H, there is shown a transporter and arraymotion and state table showing a sequence of movements for transporterpick up and drop off of wafer holder array 818, for example, at aprocess module or otherwise. Here, the table shows an exemplary sequenceof primary elements of an exchange between Transporter and a processposition, or station, which may be a Loader, Shear-Plate module,Marangoni-module, Air-knife module, Fluid-Jet module, or other typeprocess module. Here, WH elements 950 are transported from station tostation as a “virtual array” 818 in the Transporter and WH elementsbecome individually precision aligned by the respective station when theTransporter deposits them into position. In alternate aspects of thedisclosed embodiment, more or less steps may be provided in any suitablecombination.

Referring now to FIG. 31, there is shown an isometric view of a shearplate agitation module 1050 suitable for use with system 800. Module1050 provides close and repeatable alignment between the individualSP-blades 1060 and the wafer 856 surface and non-repeating oscillationfull-width of about +−20 mm (total 40 mm) using SP-blade spacing of 10mm (i.e. a primary oscillation full-width of 20 mm, together with aslower-frequency “walking” oscillation full-width of 20 mm). Twoexemplary types of alignment between Shear-Plate (SP) and Wafer, orWafer-Holder (WH) may possibly including SP to module-frame and WH tomodule-frame or WH directly to SP, and SP to module-frame. The formerhas an advantage of less tolerance stack-up and tighter alignmentbetween Wafer surface and SP agitation surfaces, while the latter hasthe advantage of not using WH surfaces for moving alignment, therebyremoving some fabrication constraints on surface finish of the WHalignment features. A problem with hot fluid processing includingstripping is condensation on horizontal surfaces above the fluid andavoiding contamination from this condensate. A movable cover, withslots, may be used to contain this vapor within the SP module 1050 andmay use the same motion to clamp the WH's in place vertically to resistthe oscillating vertical forces imparted by the Shear-Plates to theWafer surfaces. Aligning Wafer Holders to the module frame structurerather than to the Shear Plates does not require the oscillatory guidewheels of the SP to ride against WH surface. In the embodiment shown,tank 1062 holds the processing fluid, for example photoresist stripper,IPA, or DIW in which the ShearPlate assembly is immersed and into whichthe WH-Array 586 is inserted and removed. An internal frame 1066supports the WH-Array 586 and includes precisely positioned guidewheels. A series of guide wheel sets align the ShearPlates relative tothe frame and a series of guide wheel sets align WH's relative to theframe. A suitable linear motor and bearing assembly (not shown) maydrive the Shear-Plates 1060 up and down to agitate the fluid immediatelyin front of the wafer surfaces. A rotary motor and eccentric cam systemmay also be used, as will be described in more detail. A suitableautomation mechanism may move the WH's 586 vertically into the processmodule for processing and removes them vertically when processing iscomplete. Referring now to FIG. 32A-C, there are shown front views ofshear plate module 1050. Here, FIG. 32A show a front view withShearPlate in a down position; FIG. 32B in a center position and FIG.32C in an up position for a typical overall stroke of 40 mm, which issuitable for a ShearPlate motion profile that has a primary stroke of+−10 mm and a secondary profile of +−10 mm. In alternate aspects of thedisclosed embodiment, other suitable profiles or strokes may beprovided. In the embodiment shown, for each ShearPlate 1060, four setsof guide wheels may constrain its position horizontally parallel to itssurface and perpendicular to its surface while allowing motion indirection vertically parallel to its surface. Similarly, ten wheel sets,five on each side, similarly constrain each of the WH's 950 inhorizontal and perpendicular directions while allowing motion verticallyto insert and remove group of WH's 586. Precision alignment between theWH and ShearPlate guide wheel sets may be fabricated into the frameelement such that all points on the wafer are positioned to within plusor minus between 0.5 and 1.0 mm, or alternately 0.3 mm or otherwise,from the ShearPlate surface. The WH alignment may include more wheelsets (10 versus 4) in order to provide lead-in distance to fully aligneach WH 950 and each wafer 856 before the wafer is near the ShearPlate,thereby avoiding collision between the wafer and the ShearPlate.Referring also to FIGS. 33A-C, there is shown wafer holder array 586insertion into shear plate module 1050. Guide wheels for the WH's 950are on the inside 1070 of the frame to the right in FIGS. 33A-C andguide wheels for the ShearPlates1050 are on the outside 1072 of eachframe element, to the left in FIGS. 33A-C. At each guide point a pair ofwheels aligns the WH in the direction perpendicular to the wafer surfaceand a single wheel limits the WH position in the direction parallel tothe wafer surface; a pair of wheel sets at opposing parallel guidepoints fully constrains the WH in both perpendicular and paralleldirections while allowing for vertical freedom of motion for WHinsertion and removal. Similarly, at each of 4 guide points for theShearPlate a pair of guide wheels constrains the ShearPlate in directionperpendicular to its surface, a pair constrains the ShearPlate in thedirection parallel to its surface, and the pair of opposing wheel setsfully constrain the ShearPlate in direction parallel to its surface.Referring also to FIG. 34, there is shown an end section view of module1050.

Referring also to FIG. 35, there is shown an isometric section view ofmodule 1050. One aspect of immersion fluid processing is ensuringuniform macro-scale fluid flow to each wafer where fresh solution isinjected into the bottom of the process tank and overflows a weir 1080near the top of the process tank 1062 where the weir sets the solutionlevel in the tank. FIG. 34 shows a detailed cross section near the topof the wafers where an individual fluid overflow weir 1080 carries spentfluid away from the region of each individual wafer. FIG. 35 shows across section through full height of the tank 1062, fluid input manifoldand holes are shown at the bottom of the vessel for each SP 1060. Inalternate embodiments fresh fluid may be injected at the top of themodule near each wafer surface and pumped from the bottom of the tank,eliminating the need for a weir. Shear plates 1060 may be driven by oneor more linear motors or may be cantilever mounted to a bearing, forexample, on the process plumbing side of the tool and driven by a lineardrive motor, ball screw or otherwise. FIG. 35 shows the bottom of thestructure where the weirs pass through the baseplate 724, and may bewelded in from the bottom of the baseplate, prior to welding on theinput manifold 1100 which couples to the individual wafer holder by anarray of size 0.06″ or so holes 1102 along the Y direction under eachwafer holder. The weir-box structure shown may be attached to thetool-framework and aligns the wafer holders to the Transporter, wherethis structure therefore may take the linear-motion inertial loads fromthe shear plate agitation and may be a ¼″ stainless steel box orotherwise. Using gravity for chemistry return means this sits in a fluidreservoir. The weir height may be determined by being above the shearplate to avoid splashing and fluid height may be fairly close to theweir to minimize oxidation on the inside of weir passages. Insertion ofWafer holders with minimal cross-sectional area may not displace nearlyas much fluid compared with a plating cell using a 1″ thick solid bodywafer holder, so fluid change between load and unload may be minimal. Achinois type of fine mesh stainless steel strainer could be placed inthe weirs to catch resist particles, taking advantage of the significantheight of the weir. As shown the weir opening may be only 0.5″ orotherwise, where the opening may be tight for a chinois, alternately aunit may have solid steel sides with a strainer mesh welded in place asflat plates. In the embodiment shown, a separate fluid input is providedin the bottom section of the tank and a fluid weir and drain is providedin the top section of the tank with an individual input and output foreach wafer. The combination of wafer specific inputs and drains removematerial dissolved from each wafer in a repeatable manner. In analternate embodiment, only a single input manifold may be providedacross the bottom of the whole tank and a single overflow weir drain atone or two top edges of the tank may be provided. In the embodimentshown, individual overflow weirs 1104 are positioned between each of thewafer holders to better ensure wafer-to-wafer repeatability of fluidflow. The weir height may be determined by being above the SHEAR PLATEto avoid splashing and where the fluid height may be fairly close to theweir to minimize oxidation on the inside of the weir passages.Transducers may be provided, for example, level or pressure sensors orotherwise to provide an automatic signal for when to change and cleanthe chinois. In alternate aspects of the disclosed embodiment, thefeatures of module 1050 may similarly be applied to process applicationsinvolving nozzle arrays, single or batch Marangoni drying, submersionand soaking or otherwise either alone or in combination.

Referring now to FIG. 36A, there is shown a batch wafer holder 421 and abatch process module 471. Referring also to FIG. 36B, there is shown abatch wafer holder 421 and a batch process module 471. One embodiment ofthe Vertical Fluid Process 471 incorporates an apparatus for theremoving unwanted photoresist residues. The process module may include aSHEAR PLATE assembly 473 which is moved relative to the fluid tank 481by linear motors 483. As will be shown, the Wafer-Holders 421 arealigned to the SHEAR PLATES by wheels mounted on the SHEAR PLATEassembly 473. In this embodiment, only the frontside, or resist bearingside, of each wafer is agitated by a SHEAR PLATE, whereas positioned onthe backside of each wafer is a fluid overflow drain compartment whichguides the fluid past a screen to capture large resist particles anddebris removed from the front side of the neighboring wafer. FIG. 36Bshows a batch 421 of six wafer holders 421 positioned over a SHEAR PLATEprocess module 471 where FIG. 36A shows the batch 421 of six waferholders inserted into the SHEAR PLATE process module 471 and positionedfor processing. The process module 471 includes an outer tank 481 withinput and drain manifolds, a SHEAR PLATE array 473 with guide wheels485, and linear motors 483 positioned at the corners of the tank whichdrive the SHEAR PLATE array 473 in a selectively controlled verticalreciprocating pattern. One aspect of the disclosed embodiment is wherethe individual wafer holders are aligned to the SHEAR PLATE assembly 473as covered in more detail.

Referring now to FIG. 37A, there is shown a partial isometric view ofshear plate agitation module 1050. Referring also to FIG. 37B, there isshown a partial isometric view of shear plate agitation module 1050.FIGS. 37A and 37B show wafer holder array 586 being inserted orextracted from the internal frame where each holder 950 separatelyengages three guide wheel sets 1076 where additional guide wheel sets1076 are located below the upper three to positively locate each holder950 in the array of holders 586 relative to each respective shear plate1060 independent of the other holders in the holder array 586. As willbe described in greater detail, each shear plate 1060 may beindependently located on a separate set of guide wheels andindependently moveable in the vertical direction with respect to theother shear plates. Referring also to FIG. 38A, there is shown a partialisometric view of shear plate agitation module 1050. Referring also toFIG. 38B, there is shown a partial isometric view of shear plateagitation module 1050. Each guide wheel set 1076 has three guide wheels1078, 1080 and 1082 engaging a front side, outside and rear side of theleg of holder 950. Here, holder 950 has a bullet nose or lead in featurehaving a front side taper 1086, an outside taper 1088 and a rear sidetaper 1090 provided in the event there is misalignment during insertionof holder 950 into frame 1066. Referring also to FIG. 39A there is shownan isometric view of guide wheel assembly 1080. Referring also to FIG.39B there is shown an isometric view of guide wheel assembly 1078.Referring now to FIG. 40A and FIG. 40B, there are shown front views ofshear plate module 1050. Here, FIG. 40B show a front view withShearPlate 1060 in a down position and FIG. 40A in an up position for atypical full-width stroke of 40 mm, which is suitable for a ShearPlatemotion profile that has a primary stroke of +−10 mm and a secondaryprofile of +−10 mm. In alternate aspects of the disclosed embodiment,other suitable profiles or strokes may be provided. Referring also toFIG. 41, there is shown a partial isometric view of shear plateagitation module 1050. FIG. 41 shows guide wheel set 1108 that may havefeatures similar to guide wheels sets 1076. Here, guide wheel set 1108may be provided to guide shear plate agitation member 1060. Multipleguide wheel sets 1108 may be provided, for example, above guide wheelset 1108 and on opposing sides of frame 1066 to positively locate shearplate agitation member 1060 with respect to the corresponding holder950. Here, each holder is independently moveable and located withrespect to the other holders in holder array 586 where each holder ispositively and individually located with respect to each agitationmember 950 within frame 1066.

Referring now to FIG. 42A, there is shown a shear plate 1060. Referringalso to FIG. 42B, there is shown a portion of a shear plate 1060. Shearplate fabrication may include blade 1110 pitch of 10 mm or otherwise anda thickness of 1 mm or otherwise and opening span of blade 1110 being340 mm or otherwise with the geometry also further defining also theheight and width of plate 1060. For example, based on motion of 20 mmprimary cycle with 10 mm secondary cycle, for a total plus or minus 15mm motion from center, there may be 17 blades in each top and bottomhalf. In alternate aspects of the disclosed embodiment, blade stroke,number of blades, may be optimized, for example to provide additionalagitation and leaving enough space between blades to ensure resist“skins” aren't trapped within the shear plate structure. The plate 1060may be made from stainless steel 316, for example, where each blade mayweighs 1.63 lbs. Light weighting holes may be provided in the bottom andtop edges, and for example, may have 0.15 mm minimum distance from eachother and from edges of the bar. Side bars 1112, 1114 may be about 0.4inches wide or otherwise. Notches may be provided in the side bar forclearance to the wafer holder frontside guide wheels where positioningof these features may be driven from the shear plate Nest/array assemblywhere the sideplates may define the wheel positions. In alternateaspects of the disclosed embodiment, any suitable shear plate agitationmember geometry may be provided. Referring also to FIGS. 43A and 43B,frame assembly 1066 is shown with holder array 586 prepared forinsertion into tank assembly 1062. Referring also to FIG. 43C, anisometric view of tank assembly 1062 on frame 1134 is shown with shearplate agitation member drive assembly 1120. In the embodiment shown,drive assembly has a primary oscillation drive 1122 and a secondaryoscillation drive 1124. Here, the primary oscillation drive 1122 moveseach shear plate 950 in a high frequency primary oscillation motionwhereas the secondary oscillation drive 1124 moves the group of shearplates 950 in a lower frequency secondary oscillation motion. Theprimary and secondary oscillation motion(s) may be sinusoidal, modifiedsinusoidal, stepped or any suitable selective oscillatory motion.Primary motion drive 1122 is shown having servo actuator 1126 on frame1132 coupled to cam drain 1128 where cam train 28 has 8 separateeccentrics, each linked to individual coupling features 1130 where thecoupling features 1130 couple the cam train eccentrics to each shearplate agitation member 1060. In the embodiment shown, each eccentric is,for example, 45 degrees out of phase where the high frequency primarymotion has each shear plate agitation member operating similarly at 45degrees out of phase with respect to the adjacent agitation member.Alternately, any suitable phase or combination of phases may beprovided. Further, if a different number of holders is configured therelative phase lag between each may be the number of holders divided by360 degrees or otherwise. Secondary motion drive 1124 is shown havingservo actuator 1136 on frame 1134 with servo actuator 1136 coupled tofirst and second drive shafts 1138, 1140 by a timing belt or otherwise.First and second drive shafts 1138, 1140 each have two eccentrics thatcouple frame 1134 to frame 1132 such that rotation of first and seconddrive shafts 1138, 1140 causes frame 1132 to move vertically relative toframe 1134 and hence causes primary drive 1122 with shear plates 1060 tomove as a group. Here, primary drive 1122 moves the shear plateagitation members 1060 at a high frequency with members 1060 atdifferent phase angles whereas secondary drive 1124 moves the shearplate agitation members 1060 at a lower frequency with members 1060being moved together as a group in phase at the lower frequency. Inalternate aspects of the disclosed embodiment, different drives may beprovided, for example, linear motor drives or otherwise. For example, inalternate aspects of the disclosed embodiment, a linear motor drive maybe provided driving one or more agitation member(s) where the primaryand secondary motions may be provided by the linear motor drive. Inalternate aspects of the disclosed embodiment, all of the agitationmembers may be driven together in phase or in any combination ofrelative phase(s).

In accordance with another aspect of the disclosed embodiment, a system1050 for fluid processing one or more substrate surfaces arrayed in afluid is provided. The system 1050 has a process module or processsection with a frame and a plurality of agitation members 1060 to fluidprocess the substrate surfaces without contacting the substratesurfaces. A substrate holder assembly 586 having a holder frame 946 anda number of substrate holders 950, each of which is coupled to theholder frame and configured to hold a substrate so that a differentsubstrate is held by each substrate holder of the substrate holderassembly for transport therewith as a unit to and from the processmodule 1050. The substrate holder assembly and each substrate holder ofthe substrate holder assembly is removably coupled to the process moduleframe and, when coupled to the process module frame, each substrateholder is independently moveable and positionable relative to the othersubstrate holders of the substrate holder assembly 586. Each agitationmember 1060 of the plurality of agitation members may be verticallymoveable independent of the other agitation members in the plurality ofagitation members (See FIG. 43C). The surfaces of the substrates are ina substantially vertical orientation. The process module frame maycomprise a fluid tank 1062. Each of the number of substrate holders maybe removably coupled to the holder frame. The substrate holder assemblyis removable from the process module frame as a unit. Each substrateholder in the substrate holder assembly is removable from the processmodule frame independent of the other holders in the substrate holderassembly. The substrate holder assembly 586 has a number of substrateholders 950 and configured for transporting one or more substrates as aunit between the process section and another location, the substrateholder assembly and each of the substrate holders being configured forremovable coupling to the process section frame, each substrate holderin the substrate holder assembly being configured to hold at least oneof the substrates. The process section frame has alignment features 1076disposed so that, on coupling of the substrate holder assembly with theprocess section frame, the alignment features interface with eachsubstrate holder of the substrate holder assembly and locate eachsubstrate holder in repeatable alignment, at corresponding coupling ofeach substrate holder and the process section frame, with respect to theagitation members 1060 of the process section. The number of substrateholders are configured for batch transport of substrates as a unit. Themodule frame has insertion guides 1076 and each substrate holder hasmating guides depending from each substrate holder and corresponding tothe insertion guides. The insertion guides and mating guides beingconfigured so that, on coupling of the substrate holder and the moduleframe, the insertion guides receive the corresponding mating guides ofeach substrate holder aligning each substrate holder of the substrateholder assembly in repeatable alignment with respect to a correspondingagitation member 1060 in the plurality of agitation members.

Referring now to FIG. 44 there is shown a schematic view of Marangonidryer module 290. As will be described in greater detail, exemplaryMarangoni Drying System 290 allows clean drying of wafers on WaferHolders. Marangoni drying sprays a jet of solvent vapor, such asisopropyl alcohol (IPA) or otherwise near the water-line of a wafer asit is pulled out of a deionized water (DI) water bath. The difference insurface tension between water and the solvent thins the meniscus, andpulls the water from the wafer back into the bath. In the embodimentshown, Marangoni drying system 290 has IPA vapor delivery system andprocessing module 310. Module 310 has linear motors 1300 connected tomotor controller 302 and module controller 220′ that selectably andcontrollably may slowly pull wafer holder 270′ up from DI water bath1306. In alternate aspects of the disclosed embodiment, other suitabledrives may be used. In alternate aspects of the disclosed embodiment,holder 270′ may be stationary where the components of module 310 may bemoveable. In alternate aspects of the disclosed embodiment, holder 270′and/or module 310 may be individually or separately or independentlymoveable relative to each other. As will be shown, with one exemplaryembodiment, wafer holder 270′ may hold two opposing wafers (A & B).Therefore, processing module 310 and vapor delivery system 1308 may becapable of directing IPA vapor at both the A 1312 and B 1314 sidewafers. In alternate aspects of the disclosed embodiment, vapor may bedirected to a single wafer or one side of a wafer or to opposing sidesof a single wafer. Similarly, Marangoni module 310 may have othersubsystems, each of which may have an A and B side. Further, and as willbe described in greater detail below, system 290 may support drying ofmultiple wafers in a parallel single wafer drying configuration wheremultiple modules or subcomponents of modules 310 and/or 1308 may beprovided to process multiple wafers in multiple wafer holders in aparallel fashion. A Deionized Water (DIW) Bath 1306 has Weir 1316 andDrain 1318. Here, the DIW flows in a smooth fashion over weir 1316. IPAVapor Injection System 1322 directs IPA vapor just above weir 1316.Nitrogen Purge System 1326 may be used to prevent wafer oxidation whilethe wafer is lowered into the DIW bath 1306. Nitrogen Air-knife 1330 maybe used to blow off water droplets from the portion of wafer holder 270′above the wafer, so that drops do not later fall onto the clean drywafer surface. Wafer Holder Motion System 1300 may have linear motorsused, for example, to quickly lower wafer holder 270′ into the DI bath1306 and weir 1316 and to slowly pull wafer holder 270′ up. IPA VaporDelivery System (VDS) 1308 may be a commercially available chemical orvapor delivery system, for example, as supplied by Precision FlowTechnologies of Saugerties, N.Y. IPA Vapor Delivery System (VDS) 1308may have an IPA reservoir or tank that may be manually or otherwiserefillable and an IPA Bubbler that may be a vessel within a vessel. VDS1308 holds the IPA at a constant temperature to maintain a constant 3%IPA concentration in the flowing 97% N2 stream 1354. In alternateaspects of the disclosed embodiment, different concentrations withdifferent vapor and gas combination(s) may be used. As will bedescribed, solvent exhaust 1334 is connected to venture pump 1340 whichis supplied by CDA supply 1338 where solvent exhaust 1344 exhaustsdrains 1358, 1360. N2 Supply 1362 supplies Nitrogen for IPA VDS 1308 asthe source for the 97% N2 concentration in 3% IPA vapor 1354. N2 supply1342 and 1346 support N2 air knife 1330 and N2 purge distribution tube1326 respectively. DI water supply 1350 may also be provided as a DIwater source for DIW bath 1306. In alternate aspects of the disclosedembodiment, more or less features and subsystems may be provided. By wayof example, N2 purge distribution and/or N2 air knife may not beprovided. By way of further example, multiple IPA vapor injectionmanifolds may be provided in a configuration to dry one or both sides ofeach substrate in a parallel single wafer configuration where multipleholders with multiple wafers are dried by multiple IPA vapor injectionmanifolds. As such any suitable combination or configuration may beprovided.

Referring now to FIG. 45, there is shown process flow diagram 1380 forMarangoni drying suitable for use with Marangoni system 290 shown inFIG. 44 within platform 200. Prior to executing process flow 1380,system 290 may be initialized 1384 including ensuring CDA supply 1338 ison and at pressure to ensure that the IPA vapor is discharged into thesolvent exhaust manifold. Further DI Weir 1316 Flow may be enabled andchecked to be within range as insufficient or excessive Weir Flow candisrupt the Marangoni process. Further, the VDS system 1308 may bewarmed as needed to ensure proper IPA vapor percentage. Step 1386initializes linear motor 1300 at the top position and ensures thatLinMot system 1300 is at the top position and ready to accept waferholder 270′. Step 1388 of enable N2 purge provides enabling the purgebefore transporter motion and gives sufficient time to fill the processcell with N2. Here, the purpose of step 1388 is to avoid oxidation ofthe wafer during lowering of holder 270′. Step 1390 transports the waferholder to the process cell, for example, via transporter automation 280,and hands off wafer holder 270′ to LinMot system 1300. Step 1392 lowersthe wafer holder to the N2 Air-Knife position. Here and at thisposition, the wafer may be partly immersed in the DI water. Holder 270′may be briefly paused at this LinMot system 300 position. Step 1394enables N2 Air-Knife 1330. Step 1396 disables N2 Purge 1326. Step 1398continue to lower wafer holder 270′ to the bottom position. Here,Air-Knife 1330 will dry the top-most portion of the wafer holder duringthis process step. Step 1400 disables the N2 air knife 1330. Step 1402sets LinMot 1300 values for a medium raise and prepares LinMot1300 for amedium speed lifting operation. Step 1404 raises the wafer holder to aposition at which the IPA vapor is slightly above the wafer bottom. Step1406 sets LinMot 1300 values for slow raise to reduce the wafer liftingspeed to slow in order to improve the drying of the base area of WH 270′near the wafer edge and the contact ring seal lip portion of waferholder 270′ at the edge of the wafer. In alternate aspects of thedisclosed embodiment, wafer holder may not have a contact ring seal, forexample utilizing a holder where the wafer is held at portion(s) of theedge of the wafer and where the wafer is completely immersed in DIW bath1306. Step 1408 raises wafer holder 270′ to the top position. Here, thewafer and wafer holder will be dry and the wafer drying process iscomplete. Step 1410 disables DI weir 1316 flow and may also disableother suitable subcomponents as required of Marangoni dryer system 290.In alternate aspects of the disclosed embodiment, more or less steps maybe provided to support individual and/or multiple components andsubcomponents of system 290 and in connection with the disclosedembodiment(s). In alternate aspects of the disclosed embodiment, thesame, more or less steps may be provided in any suitable similar ordifferent sequence of the steps.

Referring now to FIGS. 46A & 46B, there are shown isometric and topviews respectively of a portion of weir 1316′. Referring also to FIGS.47A, 47B and 47C, there are shown isometric and two side viewsrespectively of exemplary parallel single wafer processing module 310′.Referring also to FIGS. 48A, 48B and 48C, there are shown two isometricsection and top views respectively of exemplary parallel single waferprocessing module 310′. Referring also to FIGS. 49A and 49B, there areshown side views of exemplary parallel single wafer processing module310′. In the embodiment of exemplary parallel single wafer processingsystem 310, FIGS. 47A, 47B, 48A and 49A show multiple parallel waferholders holding single wafers in a raised position whereas FIGS. 47C,48B and 49B show multiple parallel wafer holders holding single wafersin a lowered position. In the embodiment parallel single wafer Marangonidrying module 310′ shown, multiple N2/IPA/DIW manifolds 1450 may floatin position relative to tank 1454 and may be aligned independent of tank1454. As will be described in greater detail below, manifolds 1450incorporate an IPA/N2 vapor injection portion that incorporates a linearnozzle in close proximity to a DIW weir and solvent exhaust portion tofacilitate drying of both sides of wafers 1456. System 310′ is shownusing flexure based wafer holders 1460, for example, as described.Alternately, any suitable wafer holder may be used. With holders 1460,less water may be displaced by the flexure type holder than, forexample, a sealed-body wafer holder of the type used for electroplatingwhich requires electrical and fluid sealing surfaces. Sufficient weirflow at each drying or processing location of each wafer may be providedin order to ensure sufficient dilution of IPA-vapor-saturated water atthe drying site(s). Sufficient flow thereby maintains the concentrationgradient needed for high-throughput Marangoni drying. An exemplarydesign feature to promote weir flow across all processing locations mayinclude balanced height weirs, for example, to within approximately 1 mmor otherwise. A further exemplary design feature to promote weir flowacross all processing locations may include weir designs in which all ora significant fraction of the weirs are permanently wetted. By way ofexample, this may be accomplished with a scalloped weir in directionsboth parallel and perpendicular to the wafer as shown in FIGS. 46A and46B thus promoting weir flow even for processing locations with slightlylower weir height. A further exemplary design feature to promote weirflow across all processing locations may include mechanism 1464 toproduce fluid agitation in the common reservoir promoting weir flow evenfor drying processing locations with slightly lower weir height. Here,mechanism 1464 may be an oscillating board, a non-axisymmetric rotatingsystem, an oscillating bellows, a piston, a pump with actuated valve orany other suitable method to create waves and fluid motion to promotelocalized weir flow. In the embodiment shown, an 8-wafer array ofholders 1460 is shown which may be increased or decreased to anysuitable number, for example, expanded to 13 or otherwise for higherthroughputs. In the embodiment shown, the transporter 280 direction oftravel 282 for transporting holders to and from loader 274 and modules210 and Marangoni dryer 310′, may be set by the loader such thatTransporter travel 282 may be parallel to wafer. In alternate aspects ofthe disclosed embodiment, any suitable orientation or direction(s) oftravel may be provided. As seen, Z-stage 1470 of module 310′ shown inthe UP or raised position accepts holders 1460 with wafers 1456 fromTransporter 280. Here, Z-stage 1470 may have holder support 1472 coupledto vertical carriage that is guided by guides 1476 and driven by asuitable drive, such as a linear motor drive or any suitable drive inthe vertical direction 1478. As seen with Z stage 1470 shown in a downposition with wafers 1456 fully immersed in DIW 1482, from where Z stage1470 may slowly extract wafers through the Linear IPA Nozzle Exhaust andWeir (LINEW) assembly 1450. In the embodiment shown, process piping (notshown for clarity) may come out the side of module 310′ in X direction1484, from the ends of each LINEW, and may make a turn 90 degrees towardthe back of tool 200 into process support region 284. In the embodimentshown, holder support 1472 may provide for compliance and/or allowrelative movement between each individual holder of the group of holders1460 where each individual holder is not coupled to any other individualholder of holder array 1460. Alternately, holder array 1460 may beprovided with compliance between each individual holder. Here and aswill be described in greater detail below, each individual holder withinholder array 1460 may be independently positioned within module 310′with respect to the individual holder's corresponding components ofmanifold(s) 1450. For example, and as will be shown, wafer holders 1460may be engaged with alignment wheels built into the LINEW array 1450such that each WH within array 1460 is aligned precisely with each ofthe LINEW elements in the array. Here, transporter 280 drop-off motionto holder support 1472 may include a compliant engagement with thealignment wheels, thereby avoiding need for a Z-stage cradle to restrainrotation about theta-X axis (i.e. rotation about an axis parallel to thewafer surface). In the embodiment shown, the XY datum for tool 200 maybe the hand-off position between transporter 280 and Z drive 1470 wheretank 1454 for the Dryer-module 310′ may then be lower than the tanks forother process modules, for example, shear plate modules or othersuitable modules. In alternate aspects of the disclosed embodiment, anysuitable module may be provided, for example, air knife module(s), N2purge distribution modules or otherwise.

Referring now to FIGS. 50A-C, there is shown a section view of a LinearIPA Nozzle Exhaust and Weir (LINEW) assembly 1450. In the embodimentshown, linear IPA nozzle exhaust and weir assembly 1450 has manifolds1510, 1512 and 1514, each having N2/IPA input portion 1520, N2/IPA vaporinjection portion 1522, DIW weir 1524, N2/IPA output portion 1526 andDIW output portion 1528. In the embodiment shown, input and outputportions are in communication with and shared with two opposing N2/IPAvapor injection portions and two opposing DIW weir portions on eachmanifold or individual LINEW of the array of manifolds. In alternateaspects of the disclosed embodiment, more or less portions may be sharedor isolated. In alternate aspects of the disclosed embodiment, more orless manifolds may be provided. In the embodiment shown, DIW weiroverflow at DIW level 1530 flows directly into the LINEW manifolditself, thereby avoiding need to provide a separate DIW return pathdownward into a secondary vessel. In FIG. 50A, liquid and N2/IPA vaporflow through LINEW manifolds 1510, 1512, 1514 are shown, for example fora one or two wafer holder array. Here, the LINEW array of manifolds issitting in tank 1454 of DIW 1582 such that input pumping 1532 of the DIWcauses it to flow upward 1534, 1536, 1538, 1540 through slots 1542, 1544in the LINEW array of manifolds and over 1556 the individual weirs 1524formed by weir edges 1550 of lower LINEW manifold elements 1552 suchthat the DIW level 1530 is only slightly above the weir edge 1550. DIWoutput flows through an array of slots 1560 and into a cross bore 1562that is connected to a tube on the end of each LINEW manifold. IPA/N2vapor enters from one end of the LINEW manifold and is distributedhorizontally (i.e. in/out of page in FIG. 50B) along the nozzle by acavity formed between the top 1570 and middle 1572 elements of the LINEWmanifold. An array of cross slots 1574 serves as a distribution manifoldto feed the IPA/N2 uniformly into the ejector slot 1576 which may be,for example, a 0.01″ or other suitable gap between the top 1570 andmiddle 1572 LINEW manifold elements at their outer edge. An exhaust flowis pulled out of the LINEW manifold through a horizontal channel 1580formed by an enclosed cavity between the upper middle 572 and lowermiddle 1553 LINEW manifold elements where channel may be in 1580 incommunication with channel 1562. Here, exhaust flow uniformity along theLINEW manifold length is governed by the same array of slots 1560 in thelower element 1552 that transport the DIW from weir edge 1550 to fluidoutput channel 1562. Water mostly drops out of the exhaust flow streaminto the drain tube channel 1562 while IPA/N2, along with ambientatmospheric gas (air), is pulled by exhaust negative pressure out of theLINEW manifold by the exhaust channel 1582. In alternate aspects of thedisclosed embodiment, any suitable manifold configuration may beprovided. Referring also to FIG. 52, there is shown a section view ofmanifold array 1450. In the embodiment shown, an array of bolts 1600 areshown used to clamp together the four portions 1570, 1572, 1552, 1553 ofthe LINEW manifold 1514 to form the input IPA/N2 channel and the exhaustchannels with bolts 1600 threaded into lower element 1552. In alternateaspects of the disclosed embodiment, any suitable clamping orfabrication method having more or less portions may be used. Referringalso to FIG. 51A, there is shown an isometric view of linear IPA nozzleExhaust and weir manifold assembly 1450. Referring also to FIG. 51B,there is shown a section view of linear IPA nozzle Exhaust and weirmanifold assembly 1450. Assembly 1450 has weir drain plate 1552 and topplate 1570. IPA N2 inlet 1630 is in communication with IPA inlet channel1520 of each injector. IPA exhaust 1632 is in communication with IPAexhaust channel 1526 of each injector. Water drains 1643, 1636, 1638,1640 are in communication with drain channels 1562 which are incommunication with drain channels 1528 of each weir. Referring also toFIG. 51C, there is shown a top view of weir drain plate 1552. Referringalso to FIG. 51D, there is shown a section view of weir drain plate1552. Here, weir drain plate 1552 serves as a structural support andprovides weir/DIW discharge. As seen in FIG. 51C, water drains 1643,1636, 1638, 1640 are in communication with drain channels 1562 which arefurther in communication with drain channels 1528 of each weir 1524where DIW flows over the edge 1550 of each weir 1524 and is drainedthrough drains 1634, 1636, 1638, 1640. In an alternate aspect of thedisclosed embodiment, each weir may be lowered at edges 1644 and 1646 tofacilitate drainage. Here, each weir may be back cut, tapered orotherwise. With such lowered edges, the flow is directed parallel to thewafer surface where the weir may drain at the edges outside the diameterof the wafer. As seen in FIG. 51D a two level weir 1524 is show in analternate aspect of the disclosed embodiment. Weir 1524 is shown havingprimary weir 1550 and secondary weir 1650. Water flows over the primaryweir 1550 filling channel 1652 and then over secondary weir 1650 intodrainage channel 1528 and then to drainage channel 1562. Channel 1652serves as a reservoir of water localized between the primary andsecondary weirs where the difference in height between the primary andsecondary weir may be less than a capillary length or approximately 2 mmor otherwise. This allows fluid communication between the main watersource and the reservoir and promotes wetting of the primary weir andincreases uniformity of flow over the weir. In alternate aspects of thedisclosed embodiment, any suitable weir geometry may be provided.Referring now to FIG. 53A, there is shown an isometric view of a holderin a linear IPA nozzle exhaust and weir assembly. Referring also to FIG.53B, there is shown an isometric view of a holder in a linear IPA nozzleexhaust and weir assembly 1450. In the embodiment shown, 3 arrays of 3rollers 1620 each are disposed to constrain each leg of holder 270′ suchthat the surface of wafer 1456 remains at a predetermined distance fromthe IPA Vapor injection and the weir portions of Linear IPA NozzleExhaust and Weir assembly 1450. In alternate aspects of the disclosedembodiment, more or less rollers or other suitable guidance and locationof holder 270′ and/or wafer 1456 with respect to the IPA Vapor injectionand weir portions of Linear IPA Nozzle Exhaust and Weir assembly 1450may be provided.

In accordance with another aspect of the disclosed embodiment, asubstrate drying apparatus 310′ for drying a width of a surface of asubstrate in a liquid is provided. The substrate drying apparatus 310′has a liquid tank 1454 containing the liquid. An injection nozzle 1576is coupled to the liquid tank, the injection nozzle having a continuousknife edge injection surface across the width of the surface of thesubstrate. A drain 1524 is coupled to the injection nozzle, the drainhaving a continuous drain surface substantially parallel to thecontinuous knife edge injection surface and across the width of thesurface of the substrate 1456. The liquid forms a meniscus between thecontinuous drain surface and the width of the surface of the substrate.The injection nozzle directs a vapor at the meniscus. The substrate isin a substantially vertical orientation. The substrate is coupled to aholder, the holder and the substrate movable relative to the injectionnozzle and the drain. The continuous drain surface 1524 forms a weirthat is substantially permanently wetted. The continuous drain surfaceforms a weir that is scalloped in directions both parallel andperpendicular to the wafer surface. The substrate drying apparatus mayfurther have a liquid reservoir adapted to replenish the liquid, theliquid reservoir having a fluid agitation mechanism agitating theliquid. The drain may comprise a drainage manifold having a lower liquiddrainage portion 1528 and an upper vapor exhaust portion 1526. System310′ may be a Marangoni dryer apparatus for drying a width of a surfaceof a substrate in a liquid. The injection nozzle may be coupled to acombination liquid and vapor drain. The combination liquid and vapordrain has a continuous drain surface 1524 substantially parallel to thecontinuous knife edge injection surface 1576. The continuous knife edgeinjection surface and the continuous drain surface being continuousacross the width of the wafer. Vapor is injected along the length of thecontinuous knife edge injection surface to a meniscus formed between thesurface of the substrate and the combination liquid and vapor drain, andwherein the liquid and vapor flows into the combination liquid and vapordrain. In accordance with another aspect of the disclosed embodiment, amultiple substrate drying apparatus 310′ for drying opposing surfaces ofmultiple substrates in a liquid is provided. The multiple substratedrying apparatus has a liquid tank containing the liquid. A plurality ofmanifolds 1450, each manifold proximate each of the opposing surfaces ofthe substrates each manifold having an injection nozzle coupled to theliquid tank. Each manifold has a drain coupled to the injection nozzle,the drain having a continuous drain surface substantially parallel tothe continuous knife edge injection surface and across the width of thesurface of the substrate. The liquid forms a meniscus between eachcontinuous drain surface and the width of each of the surfaces of thesubstrates, and wherein the injection nozzle directs a vapor at themeniscus.

Referring now to FIG. 54, there is shown an isometric view of Marangonidry module 700 suitable for use with holder 706. Referring also to FIG.54, there is shown a cross section view of Marangoni dry module 700suitable for use with holder 706. In the embodiment shown, holder 706may support two wafers on opposite sides of holder 706 where the twowafers each only have a single external surface exposed to the DIW bath,for example, where two contact ring seals (CRS) are provided with holder706 to seal against an external edge of the wafers and isolate theinternal surfaces of the wafers as well as an internal portion of holder706 from the DIW bath. Marangoni dry module 700 has LinMot verticaldrive 710 with counterweight 712 that counterweights a driven cradlewith holder to selectively raise and/or lower holder 706 at a desiredselectable rate and motion profile. Marangoni dry module 700 hasopposing IPA injector modules 716, 720; opposing N2 purge distributionmodules 724, 726 and opposing air knife modules 730, 732. Bracket 736may be provided for control valve(s). In the embodiment shown, the N2purge manifolds are shown above the IPA injectors with Swagelok fittingon inlet and discharge of IPA injector. N2 purge manifold 724 is shownas a tube with holes 746 spaced uniformly apart. The tube is shownbolted to the side of container plate 748 via a mounting flange and isshown having a pipe threaded connection on one end. A male connectorSwagelok fitting is shown for the IPA injector inlet 750 and exhaust754. Here, the fitting may be installed after the IPA manifold is boltedto the container support plate. In alternate aspects of the disclosedembodiment, any suitable manifold geometry, fittings or connections orotherwise may be provided. N2 purge 724, 726 shown prevents oxidationduring hand-off of wafers from the purged enclosed transportenvironment. Bottom plate 760 has (2) DIW/Solvent discharge holes 762,764 and single hole 766 for DI water inlet for the DIW bath in Marangonidry module 700 as will be further described. FIG. 54 shows Marangoni drymodule 700 with holder 706 in a lowered position; however with loweringof counterweight 712 upon actuation of linear motors 710, holder 706 maybe raised to a raised transfer position. FIG. 55 also shows dry module700 with holder 706 in a lowered position. Bottom plate 760 is shownhaving inlet center tube 766 for DI water inlet, with side tubes 762,764 for DI water drain. Outer container plates 780, 782 are sealed tobottom 760 and side plates 748, 768 for structural rigidity and toprevent drain DI water from leaking out of bottom plate 760. Innercontainer plates 784, 786 are sealed to bottom 760 and side plates 748,768 and extend up to IPA injectors 716, 720 to isolate supply DIW fromdrain DIW. Air knifes 730, 732 are shown located above the IPA Injectionmanifolds 716, 720. Machine HDPE blocks 790, 792 are shown on the topplate 794 to guide wafer holder 706 in position. Referring also to FIG.56A, there is shown an isometric view of IPA injector nozzle 720 havingIPA input fitting 754 and IPA vapor exhaust fitting 754. Referring alsoto FIGS. 56B and 56C there are shown cross sections respectively of IPAinjectors 716, 720 and air knifes 730 and 732 where both the IPAinjection manifolds and air knifes clear wafer holder 706 and CRS 805,807 respectively. Referring also to FIG. 57A, there is shown anisometric partial section view of bottom plate 760 in module 700. Here,the DI water inlet is shown as a plate 813 with a series of evenlyspaced holes coupled to bottom plate 760. Referring also to FIG. 57B,there is shown an isometric view of plate 784 with studs 871 forcoupling plate 784 to IPA injector nozzle 720. Referring also to FIG.58, there is shown a section view of IPA injector nozzles 716, 720 withholder 706 in a lowered position. IPA injector nozzle 720 hastop-section 841, mid-section 843 and lower-Section 844 and provides asimilar concept of using a primary manifold surface and secondary slotsto spread the incoming or outgoing fluid or gas flow for three flows:(1) forced incoming N2/IPA 851 and passive air flow 853; (2) outgoingN2/air 855; (3) DIW 856 overflowing the weir and into an array of holes859 in lower section 845. The 3 sections 841, 843, 845 may be heldtogether by screws 861 inserted from the top allowing bottom-section 845to be bolted onto the weir-wall and leveled with full view of the fluidflow over the weir 865. Sections 841, 843 may then be bolted down todefine the N2/IPA flow gap and the exhaust cavity. Top to Mid sections841, 843 may be aligned in Y by a 0.04″ wide linear boss/slotcombination or otherwise with the Mid to Lower sections 843, 845 alignedby the bolt shafts and the flat or otherwise. Top to Mid alignmentdefines a gap, such as a 0.01+−0.02″ wide air-gap. Inner fluidcontainment between inner weir plate 784 and IPA injector 720 is madecontinuous, or acceptably fluid tight, with the Injector assembly 720using stud-welded threaded studs 871 on the Weir-Plate 784 to whichInjector 720 is bolted and pulling the Injector tight against theWeir-Plate to make a reasonably leak tight fluid seal. Adjustmentcapability may be provided: (1) Theta-Y: (i.e. making the weirperpendicular to plumb-line so fluid flow thickness is uniform; whichmeans parallel to the Top-Plate attach surfaces, may be accomplished byloose fit on the studs to their holes; (2) Z and X positions: (i.e.making left and right identical) same as Theta-Y; (3) Y offset from WHusing shim plate or otherwise; (4) Theta-Z and Theta-X: no adjustment,these may be set by the weldment of the Weir-Plate. In alternate aspectsof the disclosed embodiment, more or less adjustment may be provided. Inthe embodiment shown, a fluid vessel may be made by clamping theInjector-assembly 720 against the Weir-Plate 784 which may be weldedinto the frame. Referring now to FIG. 59, there is show a cross sectionof N2 air knife portion showing clearance between CRS 805, 807. Airknife 732 has upper portion 875 bolted 879 to lower portion 877 where agap 881 between opposing surfaces of upper portion 875 and lower portion877 forms a fluid jet across the surface of a substrate from N2 pressuresource 883. Referring now to FIGS. 60A-C there are shown section viewsof holder 706 having two wafers W in Marangoni dryer module 700. Holder706 has locating feature linear protrusion 887 that mates with guidingfeature 889 in the module frame. Here, guiding feature may also includea lead in profile as shown in FIG. 60A. In alternate aspects of thedisclosed embodiment, more or less features may be provided.

Referring now to FIG. 61A, there is shown a view of wafer holder 2400and linear nozzle 2430. Referring also to FIG. 61B, there is shown aview of wafer holder 2400 and linear nozzle 2430. Referring also to FIG.61C, there is shown a view of wafer 2300 and linear nozzle 2430. In theembodiment shown, linear nozzle 2430 provides uniform gas flow to one ormore wafer surface(s) 2302, 2302′. One embodiment may have a verticalprocess tool that may include a process module that provides uniform,and possibly high velocity, gas flow impingement on the wafer surface.This embodiment may be used for example with nitrogen gas flow fordrying a wafer, a so called “air knife” configuration. Alternately, thisembodiment may be used for applying dilute gas borne coatings to a wafersurface prior to electro deposition. The flexure wafer-holder andprocess module alignment elements of the disclosed embodiment providecapability to position a linear nozzle close to the wafer surface asdisclosed below. In alternate aspects of the disclosed embodiment, thelinear nozzle and precision alignment technique disclosed may be usedwith a sealed wafer holder for electroplating applications, for example,as described in U.S. Pat. No. 7,445,697, U.S. Pat. No. 7,722,747, U.S.Pat. No. 7,727,336, all of which are hereby incorporated by referenceherein in their entirety. In the embodiment shown, a wafer holder 2400is positioned relative to a linear nozzle 2430 by a process modulealignment guide (not shown) that also moves the linear nozzle 2430relative to the wafer holder 2400 (or the wafer holder relative to thenozzle) so that the gas jet emitted from nozzle 2430 is moved frombottom to top covering and past the wafer surface(s) 2302, 2302′. FIG.61C shows a close-up cross section of the linear nozzle portion 2430near the wafer surface. In the embodiment shown, an approximately 0.25mm thick linear gap 2432, 2432′ angled at about 30 degrees is providedrelative to the wafer surface 2302, 2302′ respectively, and positionedabout 1 mm from the wafer frontside surface and ejects the gas at highvelocity toward the wafer surface 2302, thereby impinging on the surfacewith sufficient energy to displace most fluid so that a thin remaininglayer of fluid then quickly dries by evaporation. In alternate aspectsof the disclosed embodiment, other suitable geometries may be provided.In alternate aspects of the disclosed embodiment, the uniform precisionaligned linear gas jet may be used to apply gas borne material orotherwise onto the wafer surface. A second linear nozzle 2432′ may bepositioned about 5 mm from the wafer backside surface and also may causedrying of the backside surface and also avoids applying a significantnet gas pressure that could disadvantageously deflect the wafer. In thedisclosed embodiment, an exemplary linear nozzle construction is shown.Two fabricated pieces 2434, 2436 are bolted or epoxied together to forma sequence of primary and secondary manifolds that feed the narrowlinear gap 2432 that defines the nozzle aperature as shown in FIGS.61A-C. Separation blocks 2438 may be provided within the manifold toensure uniform pressure and flow distribution.

Referring now to FIG. 62A, there is shown a wafer holder 2400 and aprocess module 2450. Referring also to FIG. 62B, there is shown a waferholder 2400 and a process module 2450. Referring also to FIGS. 63A-C,there is shown a wafer holder 2400 and a process module 2450. In theembodiment shown, precision alignment of wafer 2300 with respect tofluid process element 2430 is provided where module 2450 uses guidewheels 2452 attached to the process module frame 2454, with the guidewheels 2452 engaging the lower sections of the wafer holder leg elementsprior to the wafer approaching the fluid process element 2430. In theexemplary embodiment, FIG. 62 shows wafer holder 2400 with wafer 2300prior to engaging the linear nozzle process element 2430 where FIG. 62Bshows wafer holder 2400 that has been passed through the linear nozzle2430. Further, FIGS. 63A-C show progressively where wafer holder 2400 ismoved into position and guided on opposing sides by the arrays of guidewheels 2452 and vertically during the process, by system automationcomponents which by way of example may be linear motor modules,transporter 280 or other suitable apparatus (not shown). In theembodiment shown, wafer holder 2400 is engaged by guide wheels 2452prior to the wafer 2300 coming into proximity with the linear nozzle2430, thereby avoiding risk of touching the wafer 2300 to the linearnozzle 2430 and causing damage to the wafer surface while attaining thefeature of close spacing of the linear nozzle 2430 to the wafer 2300during the processing phase of the vertical motion. Here, wheels 2452attached to the process frame 2454 guide the wafer holder 2400 intofinal position before the wafer 2300 enters the tight gap 2456 of thelinear nozzle 2430. Alternately or in conjunction with the disclosedembodiment, process frame guidance elements may be used in otherembodiments, such as in SHEAR PLATE fluid immersion and agitation,Marangoni-Dry, and scanning nozzle array, where this guidance aspect mayalso be applicable to a batch of wafer holder's, such as the six waferholder batch previously described, for example, in a photoresist stripsystem or otherwise. With respect to a batch application, singleguidance elements may be provided for the individual holders within thebatch or alternately less guidance elements may be provided.

Referring now to FIG. 64, there is shown a view of wafer holder array2500 and linear nozzle array 2530 in process module 2545. Referring alsoto FIG. 65A, there is shown a view of wafer holder array 2500 and linearnozzle array 2530. Referring also to FIG. 65B, there is shown a view ofwafer array 2300′ being extracted or inserted into linear nozzle array2530. Referring also to FIG. 65C, there is shown a view of wafer array2300′ being passed by linear nozzle array 2530. In the embodiment shown,linear nozzle 2530 provides uniform gas flow to one or more wafersurface(s) 2302″, 2302″′. One embodiment may have a vertical processtool that may include a process module that provides uniform, andpossibly high velocity, gas flow impingement on the wafer surface. Thisembodiment may be used for example with nitrogen gas flow for drying awafer, a so called “air knife” configuration. Alternately, thisembodiment may be used for applying dilute gas borne coatings to a wafersurface prior to electro deposition. The flexure wafer-holder andprocess module alignment elements of the disclosed embodiment providescapability to position a linear nozzle close to the wafer surface. Inalternate aspects of the disclosed embodiment, the linear nozzle andprecision alignment technique disclosed may be used with a sealed waferholder for electroplating applications, for example, as described inU.S. Pat. No. 7,445,697, U.S. Pat. No. 7,722,747, U.S. Pat. No.7,727,336, all of which are hereby incorporated by reference herein intheir entirety. In the embodiment shown, each holder in a wafer holderarray 2500 is positioned relative to each linear nozzle in a linearnozzle 2530 by a process module alignment guide (not shown) that alsomoves the linear nozzle 2530 relative to the wafer holder 2400 (or thewafer holder array relative to the nozzle array) so that the gas jetemitted from nozzle 2530 is moved from bottom to top covering and pastthe wafer surface(s) 2302″, 2302″. FIGS. 65D and 65E show a close-upcross section of the linear nozzle portion 2530 near the wafer surface.In the embodiment shown, an approximately 0.25 mm thick linear gap 2532,2532′ angled at about 45 degrees is provided relative to the wafersurface 2302″, 2302″′ respectively, and positioned about 1-4 mm from thewafer surfaces and ejects the gas at high velocity toward the wafersurfaces, thereby impinging on the surface with sufficient energy todisplace most fluid so that a thin remaining layer of fluid then quicklydries by evaporation. In alternate aspects of the disclosed embodiment,other suitable geometries may be provided. In alternate aspects of thedisclosed embodiment, the uniform precision aligned linear gas jet maybe used to apply gas borne material or otherwise onto the wafer surface.A second linear nozzle 2532′ may be positioned about 5 mm from the waferbackside surface and also may cause drying of the backside surface andalso avoids applying a significant net gas pressure that coulddisadvantageously deflect the wafer. In the disclosed embodiment, anexemplary linear nozzle construction is shown. Two fabricated pieces2534, 2536 are bolted or epoxied together to form a sequence of primaryand secondary manifolds 2537 that feed the narrow linear gap 2532 thatdefines the nozzle aperature. Separation blocks 2538 may be providedwithin the manifold to ensure uniform pressure and flow distribution. Inthe embodiment shown, precision alignment of the array of wafers 2300′with respect to fluid process element 2530 is provided where module 2545uses guide wheels 2552 attached to the process module frame 2554, withthe guide wheels 2552 engaging the lower sections of the wafer holderleg elements prior to the wafer approaching the fluid process element2530. In the embodiment shown, wafer holder 2500 is engaged by guidewheels 2552 prior to the wafer 2300′ coming into proximity with thelinear nozzle array 2530, thereby avoiding risk of touching the wafer2300 to the linear nozzle 2530 and causing damage to the wafer surfacewhile attaining the feature of close spacing of the linear nozzle array2530 to the wafer array 2300′ during the processing phase of thevertical motion. Here, wheels 2552 attached to the process frame 2554guide each of the holders in the wafer holder array 2500 into finalposition before each wafer in the wafer array 2300′ enters the tight gap2556 of the linear nozzle array 2530. Alternately or in conjunction withthe disclosed embodiment, process frame guidance elements may be used inother embodiments, such as in SHEAR PLATE fluid immersion and agitation,Marangoni-Dry, and scanning nozzle array, where this guidance aspect mayalso be applicable to a batch of wafer holder's, such as the six waferholder batch previously described, for example, in a photoresist stripsystem or otherwise. With respect to a batch application, singleguidance elements may be provided for the individual holders within thebatch or alternately less guidance elements may be provided.

Referring now to FIG. 66 there is shown a side view of fluid jetparallel single wafer process module 1300. Here, fluid process module1300 may process a plurality of substrate holders in parallel wheremodule 1300 has a plurality of linear jet nozzles corresponding to theplurality of substrate holders in a fluid processing tank and with eachof the plurality of substrate holders aligned and positioned withrespect to the corresponding one of the each of the plurality of linearjet nozzles independent of the other substrate holders. Fluid jets mayimpart fluid at high velocity to a wafer surface. Fluid-jets, i.e. fluidsprayed at high velocity through a confined gap or nozzle, causes fluidto impinge on the wafer surface with considerable velocity which may beused to overcome surface tension and wet the wafer surface or todislodge and carry away unwanted particles or debris from microscalefeatures on the wafer surface. Where the wafer to fluid-jet interface issurrounded by a gas such as air or nitrogen, the energy in the fluidstream is available to overcome surface tension and wetting forces. Afluid-jet assembly that is immersed in the ambient fluid may also beused to improve mixing at the wafer surface but most of its energy maybe absorbed by the surrounding ambient fluid. While Shear-Plate fluidagitation is useful for thinning the fluid boundary layer in front of awafer surface that is immersed in fluid, thereby increasing thetransport rate through the boundary layer of reactants to the wafersurface and reaction by products away from the wafer surface, it doesnot substantially use fluid energy to overcome wetting resistance oradvantageously dislodge particles on a wafer surface. Parallel SingleWafer (PSW) fluid-jet processing utilizing module 1300 has an array 1310of fluid-jets 1314 that are closely spaced and precisely aligned to thewafer 856 surface thereby providing efficient fluid energy transfer forprocess effectiveness and repeatability. An array 1310, or severalarrays, of fluid jets may be provided to simultaneously processing eachwafer surface within holder array 818 providing for high productivity.In module 1300, vertical orientation causes fluid to drain away from thejet to wafer line of impingement 1320, thereby ensuring that fluidenergy is not wasted by impinging on a layer of fluid, for example, aswould occur in a substantially horizontal orientation. In module 1300,an array of wafers may be processed simultaneously in a single processmodule, thereby providing economic benefit of shared fluid pumping,fluid containment and other fluid processing system elements as well asthe economic benefit of using a single motion of automation sub-systemfor transporting multiple wafers into and out of the process module.Referring also to FIG. 67, there is shown an isometric partial sectionview of a fluid jet parallel single wafer process module 1300. FIG. 66shows a front view with the front wall of the fluid containment vessel1326 removed whereas FIG. 67 shows a cross section through the fluid-jetprocess module 1300. Wafers 856 are held by Wafer-Holders 950 that havebeen delivered to the fluid-jet process unit 1300 as an array 818. Anarray of fluid jet nozzle arrays 1310 is positioned precisely withrespect to the WH-Array and is scanned vertically up and down as will beshown in greater detail below. Tank element 1326 may contain the fluidas it drips downward off the wafer surfaces and returns the fluid to apumping and filtration system which pumps the fluid back into the nozzlearray. Referring also to FIGS. 68A-C, there is shown isometric partialsection views of fluid jet parallel single wafer process module 1300.FIGS. 68A-C show fluid-jet module 1300 cross sections that depict theNozzle-Array 1310 scanning from the bottom (FIG. 68A) to the top (FIG.68C) of the wafers 856. On each end of the scan the array typicallymoves to an “over-scan” position that is slightly beyond the edge of thewafer, thereby ensuring full coverage of fluid-jet processing to thewafer surface. Conventional scanning of the Nozzle-Array in the verticaldirection may be used, for example a set of four linear motors operatingin synchrony, each disposed on one of the four corners of therectangular array; a suitable manufacturer is LinMot from Elkhorn Wis.Suitable guidance, for example by guide wheels or otherwise may be usedto accurately position each independent holder 950 with respect to itsrespective nozzle 1314. Referring also to FIG. 69, there is shown anisometric partial section view of a fluid jet parallel single waferprocess module 1300 with WH-Array 818 being inserted into theFluid-Jet-Module 1300. Referring also to FIG. 70, there is shown a sideview of a fluid jet parallel single wafer process module 1300 withWH-Array 818 being inserted into the Fluid-Jet-Module 1300. In theembodiment shown, WH-Array 818 is held by an element 946 of the systemautomation where the Transporter, which supports the weight of theWH-Array 818 and aligns it relative to features on the Fluid-Jet-Module1300 that serve to guide the WH's into precise position with respect tothe Nozzle-Array 1310. As the Transporter releases the WH's 950 each ofthe WH elements 950 is free to come into alignment with their respectiveNozzle-Manifold 1314 in the Nozzle-Array 1320 and be independentlypositioned with respect to each corresponding nozzle 1314. Referringalso to FIG. 71, there is shown an isometric partial section view of afluid jet nozzle array 1310. Referring also to FIG. 72, there is shownan isometric view of a fluid jet nozzle array 1326 within nozzle 1314.FIGS. 71 and 72 show a close-up cross section view of the region inwhich the fluid-jets impinge upon the wafer. Here, Wafer 856 is held bythe WH 950 which is precisely aligned to the nozzle manifolds 1314.Individual nozzles 1328 may be commercially available, for example fromLechler Inc., or may be custom made. Processing fluid 1330, for examplede-ionized water, solvent, or etchant, is pumped into the nozzlemanifold 1314 and distributes along the manifold cavity and enters eachindividual nozzle 1328 to emerge as a high velocity fluid jet 1330.Depicted in the figures is a commercial nozzle which emits a jet in aV-shaped fan pattern. Alternately, any suitable pattern may be used.FIG. 72 shows the horizontal array of nozzles 1326 in onenozzle-manifold 1314 positioned above the top edge of a wafer 856, i.e.in the “over-scan” position. As shown, two parallel arrays of nozzles1328, positioned apart vertically by several millimeters, andalternating laterally, so that the fluid-jet streams emanating from eachnozzle do not interfere and substantially impinge on the wafer surfaceprior to intercepting streams from other nozzles may be provided.Referring also to FIGS. 73A-C, there are shown isometric partial sectionviews of an alternate embodiment fluid jet parallel single wafer processmodule 1300′. Module 1300′ use a plurality 1340 of horizontal nozzlearrays 1342, 1344 vertically separated so that a smaller vertical scandistance is required to fully cover the wafer surface, shown in FIGS.73A-C the bottom, middle, and top scanning positions respectively for aconfiguration with two nozzle arrays for each wafer. In alternateaspects of the disclosed embodiment, any suitable combination may beprovided.

In accordance with another aspect of the disclosed embodiment, a system2545 for fluid processing one or more substrate surfaces arrayed in afluid is provided. The system has a process module or section with aframe and a plurality of fluid jet elements 2530 to inject a fluid atthe substrate surfaces without contacting the substrate surfaces. Asubstrate holder assembly 2500 has a holder frame 946 and a number ofsubstrate holders, each of which is coupled to the holder frame andconfigured to hold a substrate so that a different substrate is held byeach substrate holder of the substrate holder assembly for transporttherewith as a unit to and from the process module. The substrate holderassembly 2500 and each substrate holder of the substrate holder assemblyis removably coupled to the process module frame and, when coupled tothe process module frame, each substrate holder is independentlymoveable and positionable relative to the other substrate holders of thesubstrate holder assembly. The plurality of fluid jet elements 2530 aremoveable as a group relative to the substrate holder assembly. Thesurfaces of the substrates are in a substantially vertical orientation.The process module frame may be a fluid tank. Each of the number ofsubstrate holders is removably coupled to the holder frame. Thesubstrate holder assembly 2500 is removable from the process moduleframe as a unit. Each substrate holder in the substrate holder assemblyis removable from the process module frame independent of the otherholders in the substrate holder assembly. Substrate holder assembly hasa number of substrate holders and is configured for transporting one ormore substrates as a unit between the process section and anotherlocation, the substrate holder assembly and each of the substrateholders being configured for removable coupling to the process sectionframe, each substrate holder in the substrate holder assembly beingconfigured to hold at least one of the substrates. The process sectionframe has alignment features 2552 disposed so that, on coupling of thesubstrate holder assembly with the process section frame, the alignmentfeatures interface with each substrate holder of the substrate holderassembly and locate each substrate holder in repeatable alignment, atcorresponding coupling of each substrate holder and the process sectionframe, with respect to the fluid jet elements of the process section.The substrate holder assembly has a number of substrate holders andconfigured for batch transport of substrates as a unit, the substrateholder assembly and each of the substrate holders being configured forremovable coupling to the module frame, each substrate holder in thesubstrate holder assembly being configured to hold a substrate. Themodule frame has insertion guides 2552 and each substrate holder hasmating guides depending from each substrate holder and corresponding tothe insertion guides. The insertion guides and mating guides beingconfigured so that, on coupling of the substrate holder and the moduleframe, the insertion guides receive the corresponding mating guides ofeach substrate holder aligning each substrate holder of the substrateholder assembly in repeatable alignment with respect to a correspondingfluid jet element in the plurality of fluid jet elements 2530.

In accordance with one aspect of the disclosed embodiment, a system forfluid processing one or more substrate surfaces arrayed in a fluid isprovided, the system has a process section with a frame having aplurality of process elements to process the substrate surfaces withoutcontacting the substrate surfaces; and a substrate holder assemblyhaving a number of substrate holders and configured for transporting oneor more substrates as a unit between the process section and anotherlocation, the substrate holder assembly and each of the substrateholders being configured for removable coupling to the process sectionframe, each substrate holder in the substrate holder assembly beingconfigured to hold at least one of the substrates; the process sectionframe having alignment features disposed so that, on coupling of thesubstrate holder assembly with the process section frame, the alignmentfeatures interface with each substrate holder of the substrate holderassembly and locate each substrate holder in repeatable alignment, atcorresponding coupling of each substrate holder and the process sectionframe, with respect to a predetermined feature of the process section.

In accordance with another aspect of the disclosed embodiment, thepredetermined features comprises each of the process elements with eachof the process elements in the plurality of process elements beinglocated between the substrates.

In accordance with another aspect of the disclosed embodiment, thealignment feature comprises vertical guides aligning each of thesubstrate holders in the substrate holder assembly in repeatablealignment with respect to a corresponding process element in theplurality of process elements, wherein each of the substrate holders inthe substrate holder assembly has integral positioning features thatcooperate with mating features of each of the vertical guides.

In accordance with another aspect of the disclosed embodiment, theholder assembly comprises the number of substrate holders coupled to aframe, wherein the frame comprises an end effector coupled to atransporter and wherein the transporter is configured to move thesubstrate holder assembly to and from the process module, and whereinthe transporter is configured to move a different substrate holderassembly with the holder frame to and from the process module.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is independentlymoveable and positionable relative to the other substrate holders in thesubstrate holder assembly.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is in repeatablealignment with respect to the predetermined feature of the processsection independent of the other substrate holders in the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is in repeatablealignment with respect to a corresponding process element in theplurality of process elements and independent of the other processelements in the plurality of process elements.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process apparatus having a module witha frame and a plurality of process elements to fluid process thesubstrate surfaces without contacting the substrate surfaces; and asubstrate holder assembly having a number of substrate holders andconfigured for batch transport of substrates as a unit, the substrateholder assembly and each of the substrate holders being configured forremovable coupling to the module frame, each substrate holder in thesubstrate holder assembly being configured to hold a substrate; wherein,the module frame has insertion guides and each substrate holder hasmating guides depending from each substrate holder and corresponding tothe insertion guides, the insertion guides and mating guides beingconfigured so that, on coupling of the substrate holder and the moduleframe, the insertion guides receive the corresponding mating guides ofeach substrate holder aligning each substrate holder of the substrateholder assembly in repeatable alignment with respect to a correspondingprocess element in the plurality of process elements.

In accordance with another aspect of the disclosed embodiment, theinsertion guides comprises vertical guides aligning each of thesubstrate holders in the substrate holder assembly in repeatablealignment with respect to the corresponding process element in theplurality of process elements.

In accordance with another aspect of the disclosed embodiment, theholder assembly comprises the number of substrate holders coupled to aframe, wherein the frame comprises an end effector coupled to atransporter and wherein the transporter is configured to move thesubstrate holder assembly to and from the process apparatus, and whereinthe transporter is configured to move a different substrate holderassembly with the holder frame to and from the process apparatus.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is in repeatablealignment with respect to the corresponding process element in theplurality of process elements independent of the other substrate holdersin the substrate holder assembly.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system has a fluid process section with a frame havinga plurality of process elements to process the substrate surfaceswithout contacting the substrate surfaces; and a substrate holderassembly having a number of substrate holders and configured fortransporting one or more substrates in a vertical orientation and as aunit between the process section and another location, the substrateholder assembly and each of the substrate holders being configured forremovable coupling to the process section frame, each substrate holderin the substrate holder assembly being configured to hold at least oneof the substrates; the process section frame having vertical alignmentfeatures disposed so that, on coupling of the substrate holder assemblywith the process section frame, the alignment features interface witheach substrate holder of the substrate holder assembly and locate eachsubstrate holder in repeatable alignment, at corresponding coupling ofeach substrate holder and the process section frame, with respect to apredetermined feature of the process section with each of thepredetermined features being located between the substrates.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process section with a frame having aplurality of process elements to process the substrate surfaces withoutcontacting the substrate surfaces; a substrate holder assembly having aholder frame and a number of substrate holders, each of which is coupledto the holder frame and is configured for holding a substrate so thateach substrate holder of the holder assembly holds a different substratein the substrate holder assembly for transport as a unit with thesubstrate holder assembly to and from the process section; and thesubstrate holder assembly and each substrate holder thereof areremovably coupled to the process section frame, and at least one of thesubstrate holders of the substrate holder assembly is movable relativeto the holder frame and positionable in repeatable alignment withrespect to a predetermined feature of the process section andindependent of positioning of the holder frame with respect to theprocess section.

In accordance with another aspect of the disclosed embodiment, theholder frame comprises an end effector coupled to a transporter andwherein the transporter is configured to move the substrate holderassembly to and from the process section, and wherein the transporter isconfigured to move a different substrate holder assembly with the holderframe to and from the process section.

In accordance with another aspect of the disclosed embodiment, each ofthe number of substrate holders is removably coupled to the holderframe.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is independentlymoveable and positionable relative to the process elements.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is in repeatablealignment with respect to the predetermined feature of the processsection independent of the other substrate holders in the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, each ofthe process elements in the plurality of process elements are locatedbetween the substrates.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is in repeatablealignment with respect to a corresponding process element in theplurality of process elements and independent of the other processelements in the plurality of process elements with each of the processelements in the plurality of process elements being located between thesubstrates.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system has a process module with a frame and aplurality of process elements to fluid process the substrate surfaceswithout contacting the substrate surfaces; and a substrate holderassembly having holder frame and a number of substrate holders, each ofwhich is coupled to the holder frame and configured to hold a substrateso that a different substrate is held by each substrate holder of thesubstrate holder assembly for transport therewith as a unit to and fromthe process module; the substrate holder assembly and each substrateholder of the substrate holder assembly are removably coupled to theprocess module frame and, when coupled to the process module frame, eachsubstrate holder is independently moveable and positionable relative tothe other substrate holders of the substrate holder assembly.

In accordance with another aspect of the disclosed embodiment, theholder frame comprises an end effector coupled to a transporter andwherein the transporter is configured to move the substrate holderassembly to and from the process module, and wherein the transporter isconfigured to move a different substrate holder assembly with the holderframe to and from the process module.

In accordance with another aspect of the disclosed embodiment, each ofthe substrate holders in the substrate holder assembly is in repeatablealignment with respect to the predetermined feature of the processmodule independent of the other substrate holders in the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process module with a frame and aplurality of process elements to fluid process the substrate surfaceswithout contacting the substrate surfaces; and a substrate holderassembly having holder frame and a number of substrate holders, each ofwhich is removably coupled to the holder frame and configured to hold asubstrate in a vertical orientation so that a different substrate isheld by each substrate holder of the substrate holder assembly fortransport therewith as a unit to and from the process module; wherein,the substrate holder assembly and each substrate holder of the substrateholder assembly are removably coupled to the process module frame and,when coupled to the process module frame, each substrate holder isindependently moveable and positionable relative to the other substrateholders of the substrate holder assembly.

In accordance with another aspect of the disclosed embodiment, asubstrate holder adapted to hold and retain a substrate during verticalfluid processing of a surface of the substrate is provided, the waferholder having a frame; a first leg coupled to the frame by a firstcompliant flexure, the first leg having a first contact memberconfigured to engage a first edge of the substrate; and a second legcoupled to the frame by a second compliant flexure, the second leghaving a second contact member configured to engage a second edge of thesubstrate; wherein, upon deflection of the first and second compliantflexures, the first and second legs are moveable in substantiallyopposite directions disengaging the first and second contact fingersfrom the first and second edges of the substrate respectively.

In accordance with another aspect of the disclosed embodiment, the firstcontact member comprises first and second contact fingers engagingdifferent portions of the first edge of the substrate.

In accordance with another aspect of the disclosed embodiment, the firstcontact member comprises first, second and third contact points, thefirst contact point engaging the first edge of the substrate, the secondcontact point engaging the surface of the substrate, the third contactpoint engaging another surface of the substrate on an opposite side ofthe substrate.

In accordance with another aspect of the disclosed embodiment, the firstand second legs are moveable in the same plane.

In accordance with another aspect of the disclosed embodiment, the firstand second legs further comprise first and second integral positioningfeatures configured to cooperate with a mating locating feature.

In accordance with another aspect of the disclosed embodiment, the firstand second legs further comprise first and second leading tapered edgesconfigured to engage with a mating locating feature.

In accordance with another aspect of the disclosed embodiment, the firstcompliant flexure comprises first and second flexure elements, the firstflexure element substantially parallel to the second flexure element.

In accordance with another aspect of the disclosed embodiment, asubstrate holder adapted to hold and retain a substrate during verticalfluid processing of a surface of the substrate is provided, the waferholder having: a frame; a first leg coupled to the frame by a firstcompliant flexure, the first leg having a first contact memberconfigured to engage a first edge of the substrate; a second leg coupledto the frame by a second compliant flexure, the second leg having asecond contact member configured to engage a second edge of thesubstrate; and a handling feature coupled to the frame, the handlingfeature having a holder transporter interface surface substantiallyperpendicular to the first and second legs; wherein, upon deflection ofthe first and second compliant flexures, the first and second legs aremoveable in substantially opposite directions disengaging the first andsecond contact fingers from the first and second edges of the substraterespectively.

In accordance with another aspect of the disclosed embodiment, asubstrate holder adapted to hold and retain a substrate during verticalfluid processing of a surface of the substrate is provided, the waferholder having a frame; a first leg coupled to the frame by a firstcompliant flexure, the first leg having a first contact member havingfirst and second contact fingers configured to engage different portionsof a first edge of the substrate; and a second leg coupled to the frameby a second compliant flexure, the second leg having a second contactmember having third and fourth contact fingers configured to engagedifferent portions of a second edge of the substrate; wherein, upondeflection of the first and second compliant flexures, the first andsecond legs are moveable in substantially opposite directionsdisengaging the first and second contact fingers from the first andsecond edges of the substrate respectively.

In accordance with another aspect of the disclosed embodiment, asubstrate unload and load apparatus adapted to unload a plurality ofprocessed substrates from a plurality of arrayed substrate holders andload a plurality of unprocessed substrates to the plurality of arrayedsubstrate holders is provided, the substrate unload and load apparatushaving a frame; a plurality of processed substrate supports coupled tothe frame and configured to support the plurality of processedsubstrates; a plurality of unprocessed substrate supports coupled to theframe and configured to support the plurality of un processedsubstrates, each of the plurality of unprocessed substrate supportsalternating and interleaved with respect to each of the plurality ofprocessed substrate supports; and a holder release coupled to the frameand configured to engage the plurality of arrayed substrate holders, theholder release having a first state where the plurality of arrayedsubstrate holders releases the plurality of processed substrates fromthe plurality of arrayed substrate holders, the holder release having asecond state where the plurality of arrayed substrate holders capturesthe plurality of un processed substrates with the plurality of arrayedsubstrate holders; wherein, the plurality of processed substrates areunloaded from the plurality of arrayed substrate holders to theplurality of processed substrate supports in the first state, andwherein and the plurality of unprocessed substrates are loaded from theplurality of unprocessed substrate supports to the plurality of arrayedsubstrate holders in the second state.

In accordance with another aspect of the disclosed embodiment, theplurality of processed substrates are unloaded from the plurality ofarrayed substrate holders while in a vertical orientation, and whereinthe plurality of unprocessed substrates are loaded to the plurality ofarrayed substrate holders while in a vertical orientation.

In accordance with another aspect of the disclosed embodiment, theplurality of processed substrate supports and the plurality ofunprocessed substrate supports are coupled to the frame with an indexer,wherein the indexer simultaneously moves the plurality of processedsubstrate supports and the plurality of unprocessed substrate supportsfrom a first position where the plurality of processed substrates areunloaded from the plurality of arrayed substrate holders to a secondposition where the plurality of unprocessed substrates are loaded to theplurality of arrayed substrate holders.

In accordance with another aspect of the disclosed embodiment, theholder release disengages substrate edge support members of theplurality of arrayed substrate holders from edges of the plurality ofprocessed substrates when in the first state, and wherein the holderrelease engages the substrate edge support members to edges of theplurality of unprocessed substrates when in the second state.

In accordance with another aspect of the disclosed embodiment, each ofthe plurality of unprocessed substrates supported by the plurality ofunprocessed substrate supports are alternating and interleaved withrespect to each of the plurality of processed substrates supported bythe plurality of processed substrate supports.

In accordance with another aspect of the disclosed embodiment, each ofthe plurality of unprocessed substrates supported by the plurality ofunprocessed substrate supports are axially aligned with respect to eachof the plurality of processed substrates supported by the plurality ofprocessed substrate supports.

In accordance with another aspect of the disclosed embodiment, edges ofthe plurality of unprocessed substrates are supported by the pluralityof unprocessed substrate supports, and wherein edges of the plurality ofprocessed substrates are supported by the plurality of processedsubstrate supports.

In accordance with another aspect of the disclosed embodiment, asubstrate unload and load apparatus adapted to unload a plurality ofprocessed substrates from a plurality of arrayed substrate holders andload a plurality of unprocessed substrates to the plurality of arrayedsubstrate holders is provided, the substrate unload and load apparatushaving a frame; a plurality of processed substrate supports coupled tothe frame and configured to support the plurality of processedsubstrates; a plurality of unprocessed substrate supports coupled to theframe and configured to support the plurality of un processedsubstrates, each of the plurality of unprocessed substrate supportsalternating and interleaved with respect to each of the plurality ofprocessed substrate supports; and a holder release coupled to the frameand configured to engage the plurality of arrayed substrate holders, theholder release having a first state where the plurality of arrayedsubstrate holders releases the plurality of processed substrates fromthe plurality of arrayed substrate holders, the holder release having asecond state where the plurality of arrayed substrate holders capturesthe plurality of un processed substrates with the plurality of arrayedsubstrate holders; wherein, the plurality of processed substrates aresimultaneously unloaded as a processed substrate group from theplurality of arrayed substrate holders to the plurality of processedsubstrate supports in the first state, and wherein and the plurality ofunprocessed substrates are simultaneously loaded as a unprocessedsubstrate group from the plurality of unprocessed substrate supports tothe plurality of arrayed substrate holders in the second state.

In accordance with another aspect of the disclosed embodiment, asubstrate unload and load apparatus adapted to unload a plurality ofprocessed substrates from a plurality of arrayed substrate holders andload a plurality of unprocessed substrates to the plurality of arrayedsubstrate holders is provided, the substrate unload and load apparatushaving a frame; a plurality of processed substrate supports coupled tothe frame and configured to support the plurality of processedsubstrates; a plurality of unprocessed substrate supports coupled to theframe and configured to support the plurality of un processedsubstrates, each of the plurality of unprocessed substrate supportsalternating and interleaved with respect to each of the plurality ofprocessed substrate supports; a plurality of holder supports coupled tothe frame and configured to support and align each holder of theplurality of arrayed substrate holders independent of the other holdersin the plurality of arrayed substrate holders; and a holder releasecoupled to the frame and configured to engage the plurality of arrayedsubstrate holders, the holder release having a first state where theplurality of arrayed substrate holders releases the plurality ofprocessed substrates from the plurality of arrayed substrate holders,the holder release having a second state where the plurality of arrayedsubstrate holders captures the plurality of un processed substrates withthe plurality of arrayed substrate holders; wherein, the plurality ofprocessed substrates are unloaded from the plurality of arrayedsubstrate holders to the plurality of processed substrate supports inthe first state, and wherein and the plurality of unprocessed substratesare loaded from the plurality of unprocessed substrate supports to theplurality of arrayed substrate holders in the second state.

In accordance with another aspect of the disclosed embodiment, a systemfor processing surfaces of a plurality of substrates is provided, thesystem having a process module having a process module frame and havinga plurality of process elements to process the substrate surfaceswithout contacting the substrate surfaces; a plurality of substrateholder assemblies, each having a number of substrate holders, each ofwhich is removably coupled to the process module frame, each substrateholder in the substrate holder assembly configured to hold a substrate;the process module frame having alignment features aligning each of thesubstrate holders in the substrate holder assembly in repeatablealignment with respect to each of the process elements in the pluralityof process elements with each of the process elements in the pluralityof process elements being located between the substrates; a loadermodule configured to unload a plurality of processed substrates fromeach of the substrate holder assemblies and load a plurality ofunprocessed substrates to each of the substrate holder assemblies; and atransporter configured to transport each of the substrate holderassemblies to and from the process module and the loader module.

In accordance with another aspect of the disclosed embodiment, thesystem further has a second process module, wherein the transporter isconfigured to transport each of the substrate holder assemblies to andfrom the process module, the second process module and the loadermodule.

In accordance with another aspect of the disclosed embodiment, thesystem further has a substrate transport front end configured totransport the unprocessed substrates from substrate carriers to theloader module and further configured to transport processed substratesfrom the loader module to the substrate carriers.

In accordance with another aspect of the disclosed embodiment, thesurfaces of the substrates are in a substantially vertical orientation.

In accordance with another aspect of the disclosed embodiment, theplurality of process elements comprises an array of agitation membersthat agitate a fluid proximate the substrate surfaces without contactingthe substrate surfaces.

In accordance with another aspect of the disclosed embodiment, thesubstrate holder assembly is removable from the process module frame asa unit.

In accordance with another aspect of the disclosed embodiment, eachsubstrate holder in the substrate holder assembly is removable from theprocess module frame independent of the other holders in the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, a systemfor processing surfaces of a plurality of substrates is provided, thesystem having a process module frame having a plurality of processelements to process the substrate surfaces without contacting thesubstrate surfaces; a substrate holder assembly having a number ofsubstrate holders, each of which is removably coupled to the processmodule frame, each substrate holder in the substrate holder assemblyconfigured to hold a substrate, each substrate holder in the substrateholder assembly independently moveable and positionable relative to theother substrate holders in the substrate holder assembly; each of thesubstrate holders in the substrate holder assembly in repeatablealignment with respect to each of the process elements in the pluralityof process elements with each of the process elements in the pluralityof process elements being located between the substrates; a loadermodule configured to unload a plurality of processed substrates fromeach of the substrate holder assemblies and load a plurality ofunprocessed substrates to each of the substrate holder assemblies; and atransporter configured to transport each of the substrate holderassemblies to and from the process module and the loader module.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process module frame having a pluralityof process elements to fluid process the substrate surfaces withoutcontacting the substrate surfaces; a substrate holder assembly having anumber of substrate holders, each of which is removably coupled to theprocess module frame, each substrate holder in the substrate holderassembly configured to hold a substrate, each substrate holder in thesubstrate holder assembly independently moveable and positionablerelative to the other substrate holders in the substrate holderassembly; each of the substrate holders in the substrate holder assemblyin repeatable alignment with respect to a corresponding process elementin the plurality of process elements and independent of the otherprocess elements in the plurality of process elements with each of theprocess elements in the plurality of process elements being locatedbetween the substrates, and wherein the substrate surfaces aremaintained in parallel alignment and in a vertical orientation; a loadermodule configured to unload a plurality of processed substrates fromeach of the substrate holder assemblies and load a plurality ofunprocessed substrates to each of the substrate holder assemblies; and atransporter configured to transport each of the substrate holderassemblies to and from the process module and the loader module.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process module with a frame and aplurality of agitation members to fluid process the substrate surfaceswithout contacting the substrate surfaces; and a substrate holderassembly having holder frame and a number of substrate holders, each ofwhich is coupled to the holder frame and configured to hold a substrateso that a different substrate is held by each substrate holder of thesubstrate holder assembly for transport therewith as a unit to and fromthe process module; wherein, the substrate holder assembly and eachsubstrate holder of the substrate holder assembly are removably coupledto the process module frame and, when coupled to the process moduleframe, each substrate holder is independently moveable and positionablerelative to the other substrate holders of the substrate holderassembly.

In accordance with another aspect of the disclosed embodiment, eachagitation member of the plurality of agitation members are verticallymoveable independent of the other agitation members in the plurality ofagitation members.

In accordance with another aspect of the disclosed embodiment, thesurfaces of the substrates are in a substantially vertical orientation.

In accordance with another aspect of the disclosed embodiment, theprocess module frame comprises a fluid tank.

In accordance with another aspect of the disclosed embodiment, each ofthe number of substrate holders is removably coupled to the holderframe.

In accordance with another aspect of the disclosed embodiment, thesubstrate holder assembly is removable from the process module frame asa unit.

In accordance with another aspect of the disclosed embodiment, eachsubstrate holder in the substrate holder assembly is removable from theprocess module frame independent of the other holders in the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process section with a frame having aplurality of agitation members to process the substrate surfaces withoutcontacting the substrate surfaces; and a substrate holder assemblyhaving a number of substrate holders and configured for transporting oneor more substrates as a unit between the process section and anotherlocation, the substrate holder assembly and each of the substrateholders being configured for removable coupling to the process sectionframe, each substrate holder in the substrate holder assembly beingconfigured to hold at least one of the substrates; the process sectionframe having alignment features disposed so that, on coupling of thesubstrate holder assembly with the process section frame, the alignmentfeatures interface with each substrate holder of the substrate holderassembly and locate each substrate holder in repeatable alignment, atcorresponding coupling of each substrate holder and the process sectionframe, with respect to the agitation members of the process section.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process apparatus having a module witha frame and a plurality of agitation members to fluid process thesubstrate surfaces without contacting the substrate surfaces; and asubstrate holder assembly having a number of substrate holders andconfigured for batch transport of substrates as a unit, the substrateholder assembly and each of the substrate holders being configured forremovable coupling to the module frame, each substrate holder in thesubstrate holder assembly being configured to hold a substrate; wherein,the module frame has insertion guides and each substrate holder hasmating guides depending from each substrate holder and corresponding tothe insertion guides, the insertion guides and mating guides beingconfigured so that, on coupling of the substrate holder and the moduleframe, the insertion guides receive the corresponding mating guides ofeach substrate holder aligning each substrate holder of the substrateholder assembly in repeatable alignment with respect to a correspondingagitation member in the plurality of agitation members.

In accordance with another aspect of the disclosed embodiment, asubstrate drying apparatus for drying a width of a surface of asubstrate in a liquid is provided, the substrate drying apparatus havinga liquid tank containing the liquid; an injection nozzle coupled to theliquid tank, the injection nozzle having a continuous knife edgeinjection surface across the width of the surface of the substrate; anda drain coupled to the injection nozzle, the drain having a continuousdrain surface substantially parallel to the continuous knife edgeinjection surface and across the width of the surface of the substrate;wherein, the liquid forms a meniscus between the continuous drainsurface and the width of the surface of the substrate, and wherein theinjection nozzle directs a vapor at the meniscus.

In accordance with another aspect of the disclosed embodiment, thesubstrate is in a substantially vertical orientation.

In accordance with another aspect of the disclosed embodiment, thesubstrate is coupled to a holder, the holder and the substrate movablerelative to the injection nozzle and the drain.

In accordance with another aspect of the disclosed embodiment, thecontinuous drain surface forms a weir that is substantially permanentlywetted.

In accordance with another aspect of the disclosed embodiment, thecontinuous drain surface forms a weir that is scalloped in directionsboth parallel and perpendicular to the wafer surface.

In accordance with another aspect of the disclosed embodiment, thesubstrate drying apparatus further has a liquid reservoir adapted toreplenish the liquid, the liquid reservoir having a fluid agitationmechanism agitating the liquid.

In accordance with another aspect of the disclosed embodiment, the draincomprises a drainage manifold having a lower liquid drainage portion andan upper vapor exhaust portion.

In accordance with another aspect of the disclosed embodiment, aMarangoni dryer apparatus for drying a width of a surface of a substratein a liquid is provided, the Marangoni dryer apparatus having aninjection nozzle coupled to a combination liquid and vapor drain; theinjection nozzle having a continuous knife edge injection surface; thecombination liquid and vapor drain having a continuous drain surfacesubstantially parallel to the continuous knife edge injection surface;the continuous knife edge injection surface and the continuous drainsurface being continuous across the width of the wafer; wherein, vaporis injected along the length of the continuous knife edge injectionsurface to a meniscus formed between the surface of the substrate andthe combination liquid and vapor drain, and wherein the liquid and vaporflows into the combination liquid and vapor drain.

In accordance with another aspect of the disclosed embodiment, amultiple substrate drying apparatus for drying opposing surfaces ofmultiple substrates in a liquid is provided, the multiple substratedrying apparatus having a liquid tank containing the liquid; a pluralityof manifolds, each manifold proximate each of the opposing surfaces ofthe substrates; each manifold having an injection nozzle coupled to theliquid tank, the injection nozzle having a continuous knife edgeinjection surface across the width of the surface of the substrate; andeach manifold having a drain coupled to the injection nozzle, the drainhaving a continuous drain surface substantially parallel to thecontinuous knife edge injection surface and across the width of thesurface of the substrate; wherein, the liquid forms a meniscus betweeneach continuous drain surface and the width of each of the surfaces ofthe substrates, and wherein the injection nozzle directs a vapor at themeniscus.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process module with a frame and aplurality of fluid jet elements to inject a fluid at the substratesurfaces without contacting the substrate surfaces; and a substrateholder assembly having holder frame and a number of substrate holders,each of which is coupled to the holder frame and configured to hold asubstrate so that a different substrate is held by each substrate holderof the substrate holder assembly for transport therewith as a unit toand from the process module; wherein, the substrate holder assembly andeach substrate holder of the substrate holder assembly are removablycoupled to the process module frame and, when coupled to the processmodule frame, each substrate holder is independently moveable andpositionable relative to the other substrate holders of the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, theplurality of fluid jet elements are moveable as a group relative to thesubstrate holder assembly.

In accordance with another aspect of the disclosed embodiment, thesurfaces of the substrates are in a substantially vertical orientation.

In accordance with another aspect of the disclosed embodiment, theprocess module frame comprises a fluid tank.

In accordance with another aspect of the disclosed embodiment, each ofthe number of substrate holders is removably coupled to the holderframe.

In accordance with another aspect of the disclosed embodiment, thesubstrate holder assembly is removable from the process module frame asa unit.

In accordance with another aspect of the disclosed embodiment, eachsubstrate holder in the substrate holder assembly is removable from theprocess module frame independent of the other holders in the substrateholder assembly.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process section with a frame having aplurality of fluid jet elements to inject a fluid at the substratesurfaces without contacting the substrate surfaces; and a substrateholder assembly having a number of substrate holders and configured fortransporting one or more substrates as a unit between the processsection and another location, the substrate holder assembly and each ofthe substrate holders being configured for removable coupling to theprocess section frame, each substrate holder in the substrate holderassembly being configured to hold at least one of the substrates; theprocess section frame having alignment features disposed so that, oncoupling of the substrate holder assembly with the process sectionframe, the alignment features interface with each substrate holder ofthe substrate holder assembly and locate each substrate holder inrepeatable alignment, at corresponding coupling of each substrate holderand the process section frame, with respect to the fluid jet elements ofthe process section.

In accordance with another aspect of the disclosed embodiment, a systemfor fluid processing one or more substrate surfaces arrayed in a fluidis provided, the system having a process apparatus having a module witha frame and a plurality of fluid jet elements to inject a fluid at thesubstrate surfaces without contacting the substrate surfaces; and asubstrate holder assembly having a number of substrate holders andconfigured for batch transport of substrates as a unit, the substrateholder assembly and each of the substrate holders being configured forremovable coupling to the module frame, each substrate holder in thesubstrate holder assembly being configured to hold a substrate; wherein,the module frame has insertion guides and each substrate holder hasmating guides depending from each substrate holder and corresponding tothe insertion guides, the insertion guides and mating guides beingconfigured so that, on coupling of the substrate holder and the moduleframe, the insertion guides receive the corresponding mating guides ofeach substrate holder aligning each substrate holder of the substrateholder assembly in repeatable alignment with respect to a correspondingfluid jet element in the plurality of fluid jet elements.

It should be understood that the foregoing description is onlyillustrative of the aspects of the disclosed embodiment. Variousalternatives and modifications can be devised by those skilled in theart without departing from the aspects of the disclosed embodiment.Accordingly, the aspects of the disclosed embodiment are intended toembrace all such alternatives, modifications and variances that fallwithin the scope of the appended claims. Further, the mere fact thatdifferent features are recited in mutually different dependent orindependent claims does not indicate that a combination of thesefeatures cannot be advantageously used, such a combination remainingwithin the scope of the aspects of the invention.

1. A system for fluid processing one or more substrate surfaces arrayedin a fluid, the system comprising: a process module with a frame and aplurality of fluid jet elements to inject a fluid at the substratesurfaces without contacting the substrate surfaces; and a substrateholder assembly having holder frame and a number of substrate holders,each of which is coupled to the holder frame and configured to hold asubstrate so that a different substrate is held by each substrate holderof the substrate holder assembly for transport therewith as a unit toand from the process module; wherein, the substrate holder assembly andeach substrate holder of the substrate holder assembly are removablycoupled to the process module frame and, when coupled to the processmodule frame, each substrate holder is independently moveable andpositionable relative to the other substrate holders of the substrateholder assembly.
 2. The system of claim 1, wherein the plurality offluid jet elements are moveable as a group relative to the substrateholder assembly.
 3. The system of claim 1, wherein the surfaces of thesubstrates are in a substantially vertical orientation.
 4. The system ofclaim 1, wherein the process module frame comprises a fluid tank.
 5. Thesystem of claim 1, wherein each of the number of substrate holders isremovably coupled to the holder frame.
 6. The system of claim 1, whereinthe substrate holder assembly is removable from the process module frameas a unit.
 7. The system of claim 1, wherein each substrate holder inthe substrate holder assembly is removable from the process module frameindependent of the other holders in the substrate holder assembly.
 8. Asystem for fluid processing one or more substrate surfaces arrayed in afluid, the system comprising: a process section with a frame having aplurality of fluid jet elements to inject a fluid at the substratesurfaces without contacting the substrate surfaces; and a substrateholder assembly having a number of substrate holders and configured fortransporting one or more substrates as a unit between the processsection and another location, the substrate holder assembly and each ofthe substrate holders being configured for removable coupling to theprocess section frame, each substrate holder in the substrate holderassembly being configured to hold at least one of the substrates; theprocess section frame having alignment features disposed so that, oncoupling of the substrate holder assembly with the process sectionframe, the alignment features interface with each substrate holder ofthe substrate holder assembly and locate each substrate holder inrepeatable alignment, at corresponding coupling of each substrate holderand the process section frame, with respect to the fluid jet elements ofthe process section.
 9. The system of claim 8, wherein the plurality offluid jet elements are moveable as a group relative to the substrateholder assembly.
 10. The system of claim 8, wherein the surfaces of thesubstrates are in a substantially vertical orientation.
 11. The systemof claim 8, wherein the process module frame comprises a fluid tank. 12.The system of claim 8, wherein each of the number of substrate holdersis removably coupled to the holder frame.
 13. The system of claim 8,wherein the substrate holder assembly is removable from the processmodule frame as a unit.
 14. The system of claim 8, wherein eachsubstrate holder in the substrate holder assembly is removable from theprocess module frame independent of the other holders in the substrateholder assembly.
 15. A system for fluid processing one or more substratesurfaces arrayed in a fluid, the system comprising: a process apparatushaving a module with a frame and a plurality of fluid jet elements toinject a fluid at the substrate surfaces without contacting thesubstrate surfaces; and a substrate holder assembly having a number ofsubstrate holders and configured for batch transport of substrates as aunit, the substrate holder assembly and each of the substrate holdersbeing configured for removable coupling to the module frame, eachsubstrate holder in the substrate holder assembly being configured tohold a substrate; wherein, the module frame has insertion guides andeach substrate holder has mating guides depending from each substrateholder and corresponding to the insertion guides, the insertion guidesand mating guides being configured so that, on coupling of the substrateholder and the module frame, the insertion guides receive thecorresponding mating guides of each substrate holder aligning eachsubstrate holder of the substrate holder assembly in repeatablealignment with respect to a corresponding fluid jet element in theplurality of fluid jet elements.
 16. The system of claim 15, wherein theplurality of fluid jet elements are moveable as a group relative to thesubstrate holder assembly.
 17. The system of claim 15, wherein thesurfaces of the substrates are in a substantially vertical orientationand wherein the process module frame comprises a fluid tank.
 18. Thesystem of claim 15, wherein each of the number of substrate holders isremovably coupled to the holder frame.
 19. The system of claim 15,wherein the substrate holder assembly is removable from the processmodule frame as a unit.
 20. The system of claim 15, wherein eachsubstrate holder in the substrate holder assembly is removable from theprocess module frame independent of the other holders in the substrateholder assembly.